Carl-Zeiss-Smt Ag

Carl Zeiss Smt Gmbh

Carl-Zeiss-Stiftung

Gerald Richter

Toralf Gruner

Heiko Feldmann

Sascha Bleidistel

Olaf Conradi

Wolfgang Hummel

Andreas Frommeyer

Michael Gerhard

Bernhard Kneer

Cristian Wagner

Johannes Wangler

Siebe Landheer

Maria Johanna Agnes Rubingh

Dieter Schmerek

Joachim Schroeder

Willem Van Schaik

Uwe Schubert

The invention relates to a method for improving the imaging properties of a micro lithography projection objective, wherein the projection objective has a plurality of lenses between an object plane and an image plane, a first lens of the plurality of lenses being assigned a first manipulator for actively deforming the lens, the first lens being deformed for at least partially correcting an aberration, at least one second lens of the plurality of lenses furthermore being assigned at least one second manipulator, and the second lens being deformed in addition to the first lens. Furthermore, a method is described for selecting at least one lens of a plurality of lenses of a projection objective as actively deformable element, and a projection objective.

Method for improving the imaging properties of a projection objective, and such a projection objective

The invention relates to a method for improving the imaging properties of a micro lithography projection objective, wherein the projection objective has a plurality of lenses between an object plane and an image plane, a first lens of the plurality of lenses being assigned a first manipulator (ml, Mn) for actively deforming the lens, the first lens being deformed for at least partially correcting an aberration, at least one second lens of the plurality of lenses furthermore being assigned at least one second manipulator, and the second lens being deformed in addition to the first lens. Furthermore, a method is described for selecting at least one lens of a plurality of lenses of a projection objective as actively deformable element, and a projection objective.

The invention relates to a method -for improving the imaging properties of a micro lithography projection objective (), wherein the projection objective has a plurality of lenses (L, L, L, L, L, L, L, L) between an object plane and an image plane, a first lens of the plurality of lenses being assigned a first manipulator (ml, Mn) for actively deforming the lens, the first lens being deformed for at least partially correcting an aberration, at least one second lens of the plurality of lenses furthermore being assigned at least one second manipulator, and the second lens being deformed in addition to the first lens. Furthermore, a method is described for selecting at least one lens of a plurality of lenses of a projection objective as actively deformable element, and a projection objective.

A projection exposure system, intended in particular for microlithography, is used for generating, in an image plane, an image of a mask arranged in an object plane. The projection exposure system has a light source emitting projection light and projection optics arranged between the mask and the image. Starting from the mask, the following are arranged in the beam path of the projection optics: a first group of optical components with an overall positive refractive power; a second group of optical components with an overall negative refractive power; a third group of optical components with an overall positive refractive power; a fourth group of optical components with an overall negative refractive power, and, a fifth group of optical components with an overall positive refractive power. At least three optical subgroups having at least one optical component can be displaced along the optical axis of the projection optics. The first optical subgroup comprises the mask or at least one optical component from the first group of optical components. The second optical subgroup comprises at least one optical component from the second or the third group of optical components. The third optical subgroup comprises at least one optical component from the third or the fourth group of optical components. With such subgroups, efficient imaging error correction of the projection optics is possible.

Projection exposure system

A catadioptric projection objective for microlithography has at least one curved mirror that is deformable and adjusting elements that can deform the deformable mirror. The adjusting elements are matched to given image errors and their correction. The invention is suitable for astigmatism, fourfold wavefront-deformations due to lens heating, compaction, and the like.

Microlithography projection objective including deformable mirror with adjusting elements and systems and methods using the same

Catadioptric projection objective with adaptive mirror and projection exposure method

In a system for flushing at least one internal space of an objective, in particular an exposure projection objective for semiconductor lithography, flushing is performed by mixing at least two inert gasses in such a way that the refractive index resulting therefrom corresponds at least approximately to the refractive index of air.

System for flushing at least one internal space of an objective

An illumination system for an optical system such as a microlithographic projection exposure system includes a zoom lens 2 for varying the degree of coherence .sigma. and two axicons (22, 23) with an adjustable distance therebetween. The distance can preferably be reduced to zero. The illumination system provides continuous, conventional illumination with a variable degree of coherence .sigma. and annular illumination or multipole illumination with different geometries with low losses of light.

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Abtsgmünd, Germany

Gerald Richter