Hughes Aircraft Company

Hughes Electronics Corporation

Gerald P Chernicky

Haim Feigenbaum

Robert D Washburn

Robert F McClanahan

Christopher M Schreiber

Alan L Kovacs

Andrew A Shapiro

Bao Q Le

Ramona G Pond

William J Council

Earl H Martin

Electronic VHF/UHF power conversion circuitry is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of the low temperature co-fired ceramic structure, such as resistors, capacitors, inductors and transformers. Use of a low temperature co-fired ceramic structure as a substrate on and within which VHF/UHF power conversion circuitry is formed allows selection of various conductive and resistive inks to precisely form interconnection circuitry and selected non-semiconductor components which improves the stability and reduces the cost of VHF/UHF power conversion circuits.

Low temperature co-fired ceramic UHF/VHF power converters

A Multi-Chip-Module or MCM (66) is mounted on a supporting motherboard (64). A plurality of first contact pads (99) are formed on the module (66) adjacent to its peripheral edge for interconnection with microelectronic components (70,72,74,76,78) mounted on the module (66). Second contact pads (94) are formed on the motherboard (64) adjacent to respective first contact pads (99). A flexible cable (96) includes controlled impedance microstrip or stripline conductor (98) with first and second gold dots (100,102) at their ends. A frame (104) resiliently presses the first and second gold dots (100, 102) into connection with respective first and second contacts (99,94) for interconnection thereof. The components (70, 72,74,76,78) on the module (66) can be hermetically sealed by a cover (80), and the module (66) and cable (96) can be hermetically sealed by a first resilient ring (112) which is compressed between the frame (104) and the cover (80), and a second resilient ring (114) which is compressed between the frame (104) and the motherboard (64). Alternatively, the cover (80) and the first ring (112) can be replaced by a cover (104a) which is integral with a frame (104'). An alternative connector (136) includes a flexible cable (146) which extends around an edge of a frame (144) to enable vertical stacking of MCMs (164) and/or backplanes (138) in any combination.

Connector assembly for microelectronic multi-chip-module

Growing community of inventors

Fountain Valley, CA, United States of America

Gerald P Chernicky