Ev Group E. Thallner Gmbh

Thallner, Erich

Gerald Mittendorfer

Markus Wimplinger

Erich Thallner

Jurgen Burggraf

Friedrich Paul Lindner

Jürgen Burggraf

Paul Friedrich Lindner

Christine Thanner

A method for producing singulated encapsulated components. The method includes the steps of application of a frame structure on a substrate surface of a substrate, wherein the frame structure surrounds components arranged on the substrate surface; bonding of a cover substrate on the frame structure; hardening of the frame structure; and singulation of the encapsulated components, wherein the frame structure is formed from an adhesive.

Method for producing singulated encapsulated components

A stamp comprised of a soft stamp and a carrier fixed to the soft stamp.

Stamp and method for embossing

A method for treating a substrate having millimeter and/or micrometer and/or nanometer structures. The method includes applying at least one protective material to the structures, wherein the at least one protective material can be dissolved in a solvent, and the structures are produced by an imprinting process.

Method for treating millimetre and/or micrometre and/or nanometre structures on a surface of a substrate

A flexible substrate mount for holding a first substrate when the first substrate is being detached from a second substrate, and detachment means for debonding of the second substrate by bending the first substrate. Furthermore, this invention relates to a device for detaching a first substrate from a second substrate in one detachment direction (L) with the following features: a substrate mount for holding the first substrate, said first substrate mount being flexible in the detachment direction (L), a substrate mount for holding the second substrate and detachment means for the debonding of the first substrate from the second substrate as the first substrate bends, and a method of using the same.

Flexible substrate holder, device and method for detaching a first substrate

A method for temporary connection of a product substrate to a carrier substrate comprised of the steps of:

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Suben, Austria

Gerald Mittendorfer