North Carolina State University

Other

Calabazas Creek Research, Inc.

Gerald Lucovsky

R Lawrence Ives

Fred H Pollak

Gregory N Parsons

Hong-En Shen

Christopher L Hinkle

Daniel Zeller

A process for forming a coating for an RF window which has improved secondary electron emission and reduced multipactor for high power RF waveguides is formed from a substrate with low loss tangent and desirable mechanical characteristics. The substrate has an RPAO deposition layer applied which oxygenates the surface of the substrate to remove carbon impurities, thereafter has an RPAN deposition layer applied to nitrogen activate the surface of the substrate, after which a TiN deposition layer is applied using Titanium tert-butoxide. The TiN deposition layer is capped with a final RPAN deposition layer of nitridation to reduce the bound oxygen in the TiN deposition layer. The resulting RF window has greatly improved titanium layer adhesion, reduced multipactor, and is able to withstand greater RF power levels than provided by the prior art.

High power RF window deposition apparatus, method, and device

A semiconductor device includes a semiconductor substrate including silicon and an oxide layer on the substrate. The oxide layer includes silicon. An interfacial dielectric layer is disposed on the oxide layer opposite the substrate. The interfacial dielectric layer includes HfO, ZrO, a zirconium silicate alloy, and/or a hafnium silicate alloy having a thickness between about 0.5 nm and 1.0 nm. A primary dielectric layer is disposed on the interfacial dielectric layer opposite the substrate. The primary dielectric layer includes AlO; TiO; a group IIIB or VB transition metal oxide; a trivalent lanthanide series rare earth oxide; a silicate alloy; an aluminate alloy; a complex binary oxide having two transition metal oxides and/or a complex binary oxide having a transition metal oxide and a lanthanide rare earth oxide. A thickness of the primary dielectric layer is at least about five times greater than the thickness of the interfacial dielectric layer.

Semiconductor devices having an interfacial dielectric layer and related methods

The invention relates to non-crystalline oxides of formulas (I) and (II), and methods of forming the same, along with field effect transistors, articles of manufacture, and microelectronic devices comprising the non-crystalline oxides.

Non-crystalline oxides for use in microelectronic, optical, and other applications

Methods of forming binary noncrystalline oxide analogs of silicon dioxide

The invention generally relates to oxides that may be used in conjunction with integrated circuit devices. The oxides are non-crystalline. The oxides are represented by the formula: ABO , wherein A is an element selected form Group IIIA of the periodic table; and B is an element selected form Group VB of the periodic table. The oxides may be employed in field effect transistors as tin gate insulating layers having high dielectric constants.

Binary non-crystalline oxide analogs of silicon dioxide for use in gate dielectrics

A method for determining information about properties at interfaces of semi-conductor materials in which a probe bean monochromatic light is directed onto a material sample which is itself electromodulated by a modulated pump beam, whereby the light reflected from the sample is detected to produce a d.c. signal and an a.c. signal, and after normalizing the procedure, the shifts of energy gaps in the band gaps are evaluated to obtain information about at least one externally applied parameter crossing such shift.

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Cary, NC, United States of America

Gerald Lucovsky