Epcos Ag

Tdk Electronics Ag

Siemens Matsushita Components Gmbh & Co Kg

Gerald Kloiber

Jan Ihle

Heinz Strallhofer

Franz Schrank

Norbert Freiberger

Oliver Bard

Thomas Bernert

Gero Zimmermann

Michael Kubiak

Peter Balzer

Anke Weidenfelder

Christl Lisa Mead

Ralf Thomas Mayer

Thomas Stendel

Ingrid Rosc, Legal Representative

Berrit Ines Rosc, Legal Representative

Jördis Brit Rosc, Legal Representative

Adalbert Feltz

Lutz Kirsten

Anna Moshammer

Danilo Neuber

Claus Cernoch

Javier Arrimadas Matias

Gilbert Landfahrer

Josef Mörth

Peter Urdl

Josef MÖRTH

Javier Arrimadas-Matias

Werner Franz Krauss

Jörg Haut

An electrical component includes a base body having a contact surface on which a contact element is fastened by a solidified molten material, wherein the material is formed by a molten region of the contact element.

Method of fastening a contact element in an electrical component, and electrical component having a contact element

In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

Sensor element and method for producing a sensor element

In a method for fastening a contact element () in an electrical component (), a contact element () is arranged on a contact surface () of a base body () of the component () and a laser beam () is directed onto a region () of the contact element () in such a way that the base body () is not located in the beam direction () of the laser beam (). The contact element () is partially melted by the laser beam (), so that the molten material () wets the contact surface () and produces fastening of the contact element () on the contact surface ().

Method for fastening a contact element in an electrical component, and electrical component having a contact element

A sensor element, a sensor arrangement, and a method for manufacturing a sensor element and a sensor arrangement are disclosed. In an embodiment, a sensor element includes a ceramic main body having at least one electrode arranged at the main body and having at least one contact piece for the electrical contacting of the electrode, wherein the contact piece is fastened to the electrode by welding or bonding.

Sensor element, sensor arrangement, and method for manufacturing a sensor element and a sensor arrangement

A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element includes a ceramic carrier having a top side and an underside, a respective NTC layer arranged on the top side and on the underside of the carrier and at least one electrode, wherein a resistance of the respective NTC layer depends on a thickness and/or geometry of the respective NTC layer.

A sensor element, a sensor arrangement, and a method for manufacturing a Sensor element are disclosed. In an embodiment, a sensor element includes a ceramic main body and at least one electrode arranged at the main body, wherein the electrode has at least one layer comprising nickel.

Sensor element, sensor arrangement, and method for manufacturing a sensor element

A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element for temperature measurement includes a ceramic carrier and at least one NTC layer printed on the carrier, wherein the NTC layer covers at least part of a surface of the carrier, and wherein the sensor element is designed for wireless contacting.

An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.

Electrical device with soldered joint

A method for producing an electrical component is disclosed. In an embodiment the method includes providing a carrier element providing a material having a temperature-dependent resistance, applying the material on a surface of the carrier element for producing a resistance layer on the carrier element and subsequently sintering the resistance layer for linking the resistance layer to the carrier element.

Method for producing an electrical component

An apparatus includes a main body having an electrode and a contact element. The contact element is directly mechanically and electrically conductively connected to the electrode in order to form an electrical connection between the main body and the contact element. The electrical and mechanical connection between the electrode and the contact element is free of melting regions of the materials of the electrode and of the contact element that are involved in the connection. Furthermore, the connection is realized in a manner free of connection material, for example, in a manner free of solder material.

Apparatus and method for establishing an electrically conductive and mechanical connection

The invention relates to a temperature sensor system comprising a first ceramic housing part comprising a sleeve-shaped lower part with a first lower end having a first opening, and a second upper end having a second opening, and an upper part connected to the second upper end. The temperature sensor system further comprises a temperature probe element which is at least partially arranged in the lower part and which has a ceramic sensor element housing, a sensor element arranged in the sensor element housing, and electrical supply lines. The sensor element housing is at least partially arranged in the first opening. The ceramic sensor element housing has a higher thermal conductivity than the first ceramic housing part. Also disclosed is a method for producing a temperature sensor system.

Temperature sensor system and method for producing a temperature sensor system

The invention relates to a temperature probe comprising two first ceramic plates, a second ceramic plate arranged between the first ceramic plates, and two third ceramic plates. Each of the two first ceramic plates comprises an opening in each in which an NTC sensor element is arranged. An electrode is arranged between the second ceramic plate and each of the first ceramic plates. The first and the second ceramic plates are arranged between the two third ceramic plates. An electrode is arranged between each third ceramic plate and a first ceramic plate. Each electrode electrically contacts an NTC sensor element. Each NTC sensor element is enclosed by ceramic plates. The first, the second and the third ceramic plates and the NTC sensor elements are sintered to form a ceramic body. The invention further relates to a method for producing a temperature probe.

Temperature probe and method for producing a temperature probe

The invention relates to a temperature probe which comprises a functional ceramic probe element and a ceramic housing. The probe element is mounted in the ceramic housing so that at a face of the probe element has direct and form-fitting contact with the ceramic housing. The invention further relates to a method for producing a temperature probe.

A sensing device for detecting a physical quantity includes a molded part and a sensor element in the molded part. The sensor element includes an enclosure that is formed from the molded part and an injection-molding compound. A connection element may be connected to the sensor element. An interface may be between the sensor element and the connection element.

Sensing device for detecting a physical quantity and method for producing said sensor

A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.

Growing community of inventors

Feldkirchen, Austria

Gerald Kloiber