Medtronic, Inc.

Gerald Jordan Montgomery

William K Wenger

Christine Gale Kronich

John Louis Sommer

Michael D Eggen

Joseph A DuPay

A lead implant system includes a lead coupling device, which is configured to couple a lead during an implant procedure, in communication with a medical device and an implantable medical device, which is contained within a package that includes an electrical interface for electrical coupling with an electrical contact of the implantable medical device. The electrical interface facilitates coupling of the packaged medical device to an electrical contact of another medical device, which is located outside the package. If the electrical contact of the packaged device is mounted within a bore of the device, then the connector structure allows for passage of a sterilizing gas into the connector bore, and past the connector contact, within the bore.

Lead implant system

An electrical interface includes a contact surface and a connector structure supporting the contact surface for electrical coupling with an electrical contact of a medical device, which device is contained within a package. The electrical interface facilitates coupling of the electrical contact of the packaged medical device to an electrical contact of another medical device, which is located outside the package. If the electrical contact of the packaged device is mounted within a bore of the device, then the connector structure allows for passage of a sterilizing gas into the connector bore, and past the connector contact, within the bore.

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Blaine, MN, United States of America

Gerald Jordan Montgomery