Agilent Technologies, Inc.

Hewlett-packard Company

Gerald John D'Amato

Sari K Christensen

Nicole Butel

Guy Harlan Humphrey

Susan K Radford

Michael Jason Welch

An integrated circuit package is provided with an alignment mechanism by 1) heating a wetting media that has been applied to a number of annular ring shaped alignment pads provided on the integrated circuit package, at known locations with respect to a pattern of contacts pads that is provided on the integrated circuit package, and then 2) while the wetting media is heated, attaching a number of alignment balls or alignment bullets to the annular ring shaped alignment pads.

Methods for providing an integrated circuit package with an alignment mechanism

An integrated circuit package is provided with alignment pads which are solid or annular ring shaped. Alignment members such as balls or bullets are attached to the alignment pads via a wetting media. When heated, the wetting media serves to center and seat the alignment members on the alignment pads. When cooled, the wetting media serves to bond the alignment members to the alignment pads.

Apparatus for aligning an integrated circuit package with an interface

The present disclosure relates to a contact arrangement. The contact arrangement comprises a plurality of contacts formed along a line in a staggered configuration. The staggered configuration arranges the contacts so as to be diagonally spaced from each other along the line such that the contacts have an effective spacing along the line that is smaller than the actual spacing of the contacts. In one embodiment, the contact arrangement is used to construct an integrated circuit chip assembly that comprises a substrate having a die that is provided with a plurality of signal lines and power lines formed on its surface, the signal lines each including a plurality of signal contacts and signal contacts of at least one signal line are arranged in a staggered configuration so as to be diagonally spaced from each other along the at least one signal line such that the signal contacts have an effective spacing along the at least one signal line that is smaller than the actual spacing of the signal contacts of the at least one signal line.

High density contact arrangement

The present invention provides a hybrid chip package that utilizes a high-speed BGA structure and a plurality of flexible and reliable QFP leads. More specifically, the QFP leads are attached to a peripheral region of a substrate to surround the attached BGA structure and replace solder bumps of a conventional BGA structure that would typically flack or crack during operational cycles to create an electrical open between the conventional BGA package and the attached printed circuit board.

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Loveland, CO, United States of America

Gerald John D'Amato