Lexmark International, Inc.

International Business Machines Corporation

Gerald G Leslie

Jing X Sun

Bradley Leonard Beach

Douglas Campbell Hamilton

Terence E Franey

Peter E Wallin

Alexander D Meade

Kathryn E Dowlen

Lawrence R Daley

A release agent composition for use in an electrophotographic process is disclosed. This composition includes a specifically-defined heat-stable silicone oil-silicone wax random copolymer. The copolymer has a melting point such that it is liquid on the hot fuser roll, but solidifies at room temperature on the printed page. A random silicone copolymer, in the form of a paste or pliable caulk, which is useful for sealing leaks in toner cartridges is also disclosed. Finally, the method for preparing these copolymers is disclosed.

Release agent for electrophotographic process

A release agent composition for use in an electrophotographic process is disclosed. This composition includes a specifically-defined heat-stable silicone oil-silicone wax copolymer. The copolymer has a melting point such that it is liquid on the hot fuser roll, but solidifies at room temperature on the printed page. A random silicone copolymer, in the form of a paste or pliable caulk, which is useful for sealing leaks in toner cartridges is also disclosed. Finally, the method for preparing these copolymers is disclosed.

Transfer printing from pad (9) is made in a pattern of resist (15) which covers a via (3) on a circuit board (1) metalized with a continuous copper layer (7). After transfer of resist material (14) to the pad, the pattern on the pad is hardened enough to be self-supporting by applying moderate radiation or allowing solvent to escape from the resist on the pad. The resist is transferred from the pad to the circuit board (1) and is then fully hardened, and the circuit board is immersed in etchant to remove unprotected copper (7). Copper in the covered vias is protected and therefore separate metalizations of vias is avoided. Since pad printing is particularly useful in general with three dimensional circuit boards, the use of pad printing to avoid separate metalization of vias is economic since it involves little additional to the general use.

Pad printing of resist over via holes

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Lexington, KY, United States of America

Gerald G Leslie