Speedline Technologies, Inc.

Other

Rapid Analysis and Development Company

Gerald C Pham-Van-Diep

Eric Phillip Muntz

Melissa E Orme-Marmarelis

Robert J Balog

Robert F Smith, Jr

Patsy Anthony Mattero

Gary T Freeman

William J Johnson

Joseph A Perault

Hal Watts

Randy Leon Peckham

Richard Willshere

Hal G Watts, Jr

Melissa E Orm&eacute;-Marmarelis

Timothy J Joyce

Melvin Main

Eric J Gray

E Philip Muntz

John E Morini

An apparatus for performing operations on at least one surface of an electronic substrate having a first surface and a second surface includes a frame, a transportation system that moves the substrate through the apparatus, a substrate support system, coupled to the frame, having a non-rigid portion that contacts and supports the substrate during an operation on the substrate, wherein the non-rigid portion allows flexure of the substrate before and during the performance of an operation on the substrate, and a device coupled to the frame that performs an operation on a surface of the substrate.

Method and apparatus for supporting a substrate

A printer includes a print head for dispensing viscous material, such as solder paste. The print head defines a chamber and includes at least one source port and a dispensing slot. Within the chamber, a flexible membrane segregates the chamber into a dispensing region and an activation region. Viscous material flows from a supply mounted to the source port, into the dispensing region and out the slot. A displacement mechanism is positioned to displace the flexible membrane to reduce the volume of dispensing region and to thereby dispense viscous material through the slot. The print head also includes a removable envelope through which the viscous material flows and contacts as it passes through the envelope.

Pressure control system for printing a viscous material

A printer includes a dispensing head for dispensing viscous material, such as solder paste. The dispensing head defines a chamber and includes at least one source port and a dispensing slot, wherein the viscous material flows from a supply mounted to the source port, into the chamber and out the dispensing slot. Within the chamber, a stirring mechanism is mounted. The stirring mechanism is coupled to a drive mechanism that displaces the stirring mechanism through the chamber, thereby stirring the viscous material. The stirring mechanism is particularly effective in preventing or reducing compaction of solder paste within the chamber.

Stirring mechanism for viscous-material printer and method of printing

An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines a cavity for containing molten solder. The orifice defining structure includes a flat disk having an orifice defined therethrough for producing a stream of molten solder and a disk support structure that supports the disk around the orifice and is replaceably coupled to the cavity-defining structure. Also disclosed is an apparatus that deposits a selected pattern of solder onto a substrate and includes a substrate support, a solder ejector that directs solder droplets to desired positions on the support, and an ejector aligner that adjusts the orientation of the solder ejector in two angular dimensions to enable adjustment of the trajectory of the stream of molten solder droplets.

Jet soldering system and method

Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.

High speed jet soldering system

Continuous jetting of liquid metal droplets for deposit on a substrate includes an ejector, a deflection device, a print chute, and a collection reservoir. Liquid metal from a cartridge in the ejector provides a continuous molten material stream through an orifice-defining structure while a vibration device creates a standing wave in the stream to break the molten material stream into individual droplets which receive charge from a charging device. The deflection device enables the positioning of the charged droplets to be controlled for placement on a substrate. Control systems assist in the calibration and control of the continuous stream to ensure that selected droplets are placed at desired locations on the substrate.

An apparatus for filling filtered solder into replaceable solder cartridges for use in a system for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a cartridge support, an environmentally-controlled chamber, a solder receptacle, a heater, a molten solder flow conduit, and a separator.

Growing community of inventors

Newport Beach, CA, United States of America

Gerald C Pham-Van-Diep