Robert Boschgmbh

Gerald Brinks

Ulrich Seger

Uwe Apel

Peter Diesel

Michael Schlitzkus

Marc Zimmermann

Stefan Lehenberger

Dmitriy Aranovich

Guenter Escher

Maximilian Amberger

Hartmut Rohde

Thomas Kurzweil

Anja Beckerle

Klaus Zeh

Tobias Zoller

Matthias Pohl

A method for producing a camera. The method includes: assembling a circuit carrier and a metal frame on a surface of the circuit carrier that carries an image sensor; optically measuring the circuit carrier assembly; introducing an objective with an objective housing into a camera housing, wherein the camera housing has a camera housing collar that extends into an interior of the camera housing and has a compression element arranged on a side facing the image sensor; fastening the objective housing to the camera housing; optically measuring the objective fastened to the camera housing; compressing the compression element depending on the optical measurements; arranging the circuit carrier assembly on the camera housing and aligning along two further coordinate axes and a further rotation axis; and connecting the circuit carrier assembly and the camera housing.

Method for producing a camera, and camera

A method for manufacturing a camera module. The method includes: a) mounting an image sensor on a circuit board, b) inserting and fixing the circuit board into a housing, c) aligning an objective lens accommodated in the housing and including an electrical interface with respect to the image sensor, d) fixing the objective lens in the housing. In step b) spring contacts, which are movable with respect to the circuit board, are inserted into the housing together with the circuit board and, in a step e), i.e., after the fixation of the objective lens in the housing, are brought into contact with the electrical interface with the aid of clamping and/or fixing elements.

Method for manufacturing a camera module, camera module

A laser diode device includes a thermally conductive substrate that has a planar surface for dissipating ambient heat, and a plurality of laser diodes situated thereon, each of which includes at least one epitaxial layer that is situated on a side of the laser diode facing the substrate. The laser diodes are each electrically activated via an electrically conductive coating situated between the at least one epitaxial layer and the substrate. The substrate includes a plurality of metallized cavities that accommodate the plurality of laser diodes so that the plurality of laser diodes have an essentially uniform height above the substrate.

Laser diode device

A connection device for a pressure sensor includes a supporting unit and a circuit board. The circuit board carries an electronic circuit having at least one of at least one electronic component and at least one electrical component. The supporting unit includes a multi-part main body that is electrically and mechanically connected to the circuit board via at least one soldered connection. The supporting unit further forms an external interface having at least one electrical contact point that enables tapping of at least one electrical output signal of the electronic circuit, and that is electrically connected to a corresponding contact point of the circuit board via an electrical connection. A pressure sensor includes such a connection device, and a method pertains to producing such a connection device.

Connection device for a pressure sensor, pressure sensor, and method for producing a connection device

A camera module, in particular, for a vehicle, the camera module including at least: an objective mount and an objective, which is held in the objective mount and has a lens holder and at least one lens secured in the lens holder, the objective being fixed in position in the objective mount by a frictional connection between an outer surface of the lens holder and an inner surface of the objective mount. A plurality of frictional connection devices spaced apart in the circumferential direction are formed on the outer surface of the lens holder and/or on the inner surface of the objective mount, in order to generate the frictional connection. To insert and to adjust the objective, the objective mount is preferably asymmetrically deformed in an elastic manner, and the objective is placed into the deformed objective mount, and the elastic deformation is subsequently removed.

Camera module and method for manufacturing a camera module

An image sensor module includes an image sensor bearer and an image sensor, the image sensor bearer being fashioned as an injection-molded circuit bearer, and the image sensor being situated on the image sensor bearer, and the image sensor bearer including at least one holding device that is integrally formed on the image sensor bearer.

Growing community of inventors

Waltenhofen, Germany

Gerald Brinks