Sv Probe Pte. Ltd.

Kulicke and Soffa Industries, Inc.

Cerprobe Corporation

Gerald Back

Son N Dang

Bahadir Tunaboylu

Rehan Kazmi

Reynaldo M Rincon

H Dan Higgins

Lich Thanh Tran

Scott R Williams

Roger A Sneddon

In an embodiment, a modular space transformer for use in a probe card assembly includes a bottom plate, a guide plate, and a top plate. The guide plate is configured for mounting in a cut-out of the bottom plate. The guide plate has a first surface and a second surface and additionally has a first plurality of spaced electrical connections disposed in a plurality of apertures formed through the guide plate for providing electrical connections between a plurality of test probe contacts and a plurality of guide plate contacts. The top plate has a plurality of spaced electrical contacts disposed through the top plate with at least one of the plurality of guide plate contacts electrically connected to at least one of the plurality of spaced electrical contacts.

Modular space transformer for fine pitch vertical probing applications

A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.

Probe head structure for probe test cards

A method and apparatus for a flattened probe element wire is provided. A probe element wire includes a beam portion and a tip portion. At least a part of the tip portion is flattened. Flattened probe element wires may have greater z-direction height strength, thereby increasing maximum probe element wire z-direction vertical force. Flattened probe element wires may also have decreased variability in the flattened probe element wire tips. A probe card assembly may includes a substrate and a plurality of at least partially flattened probe element wires supported by the substrate. Such probe card assemblies may have an extended life and maintained within design parameters for a longer period of use.

Cantilever probe card

Techniques for attaching a coaxial cable to an assembly are provided. A conductive layer is applied to a top and bottom surface of a first layer and the bottom surface of a second layer. An aperture is formed through the first layer. The first layer is affixed to the top of the second layer to form an assembly. A signal via and one or more shield vias are formed in the assembly. The signal via and the one or more shield vias, are covered with a conductive layer. The signal via is then electrically separated from the shield vias and the aperture. A stripped coaxial cable may then be inserted into the aperture so that the conductive core of the coaxial cable is electrically connected to the signal via but electrically isolated from the shield vias and aperture. The coaxial cable may then be secured to the assembly.

Direct attachment of coaxial cables

A method and apparatus is provided for cleaning and shaping a probe tip using a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad is constructed on the surface of a support structure, such as a silicon wafer, and is made of an adhesive in contact with abrasive particles. Adhesive is applied in layers with abrasive particles in-between each layer of adhesive. Abrasive particles may vary in size and material from layer to layer to achieve cleaning, shaping and polishing objectives.

Method and apparatus for probe tip cleaning and shaping pad

Probe testing of an integrated circuit so as to achieve low probe needle contact resistance without probe needles &ldquo;scrubbing&rdquo; against bonding pads is achieved at high test signal frequencies by a probe needle assembly ( ) including a plurality of probe needles ( ) each having a shank portion ( A), a curved flex portion ( B), and a contact tip ( C) on a free end of the flex portion, the shank portion ( A) being electrically coupled to an electrical test system. The shank portion ( A) of each probe needle is attached to a surface ( A) of an insulative layer ( ). The insulative layer is supported on a ground plane conductor . The flex portions ( B) of the probe needles ( ) extend beyond an edge of the insulative layer. A portion ( ) of the ground plane conductor ( ) extends beyond the insulator ( ) and is adjacent to all but an extending tip portion ( ) of the flex portion ( B) of each probe needle ( ). A thin insulator/guide layer ( B) is attached to the extending portion ( ) of the ground plane conductor ( ) and disposed between the extending portion and the flex portions ( B), the insulator/guide layer ( B) having a smooth, low friction surface to guide/stabilize the flex portions ( B) during flexing. The insulative layer ( ) and insulator/guide layer ( B) provide matched impedance between the shank and flex portions of the probe needles.

Growing community of inventors

Gilbert, AZ, United States of America

Gerald Back