Rohm & Haas Electronic Materials LLC

Shipley Company LLC

Rohm and Haas Electronics Materials LLC

Gerald B Wayton

Suzanne M Coley

Peter Trefonas, Iii

Tomoki Kurihara

Anthony Zampini

James W Thackeray

Michael K Gallagher

Gregory P Prokopowicz

Stewart A Robertson

Cong Liu

Charles R Szmanda

Vipul Jain

Owendi Ongayi

Vaishali Raghu Vohra

Organic coating composition are provided including antireflective coating compositions that can reduce reflection of exposing radiation from a substrate back into an overcoated photoresist layer and/or function as a planarizing or via-fill layer. Preferred organic coating compositions of the invention comprise one or more resins that can harden upon thermal treatment without generation of a cleavage product. Particularly preferred organic coating compositions of the invention comprise one or more components that comprise anhydride and hydroxy moieties.

Coating compositions for use with an overcoated photoresist

Coating compositions for use with an overcoated photoresist are provided where the coating composition comprises a resin containing cyanurate groups and hydrophobic groups. The coating composition can enhance resolution of an overcoated photoresist relief image.

In a first aspect, organic coating compositions are provided, particularly spin-on antireflective coating compositions, that contain a polyester resin component. In a further aspect, coating compositions are provided that contain a resin component obtained by polymerization of a multi-hydroxy compound. Coating compositions of the invention are particularly useful employed in combination with an overcoated photoresist layer to manufacture integrated circuits.

Coating composition for use with an overcoated photoresist

The present invention relates to barrier layer compositions that are applied above a photoresist composition for immersion lithography processing. In a further aspect, new methods are provided for immersion lithography processing.

Compositions and processes for immersion lithography

Underlying coating compositions are provided for use with an overcoated photoresist composition. In one aspect, the coating composition can be crosslinked and comprise one or more components that contain one or more acid-labile groups and/or one or more base-reactive groups that are reactive following crosslinking. In another aspect, underlying coating composition are provided that can be treated to provide a modulated water contact angle. Preferred underlying coating compositions can exhibit enhanced etch rates in plasma etchants. Additional preferred coating compositions can enhance lithographic performance of an associated photoresist composition.

Underlying coating compositions are provided for use with an overcoated photoresist composition. In one aspect, the coating composition can be crosslinked and comprise one or more components that contain one or more acid-labile groups and/or one or more base-reactive groups that are reactive following crosslinking. In another aspect, underlying coating composition are provided that can be treated to provide a modulated water contact angle. Preferred coating compositions can enhance lithographic performance of an associated photoresist composition.

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Leicester, MA, United States of America

Gerald B Wayton