Hughes Aircraft Company

Lippel Cybersonics, Inc.

Gerald B Smith

Raymond L Brown

Vicente Soto

Helen Congleton

Carol L Slaton

John R Valvo

Angelo Koudounaris

Arthur T Lippel

Discrete solder preforms (28, 14a, 14b, 14c) are quickly and accurately placed on substrates (10) to be soldered by means of a foil sheet (24) apertured (26) with the pattern of preform placement. The foil sheet has a vacuum drawn through its apertures, and a number of discrete solder preforms are randomly projected from a vibratory membrane (38) up against the foil to be attached to the foil at each of its apertures. Then the foil sheet with its vacuum attached solder preforms (28, 14a, 14b, 14c) is moved into registration with the flux pattern (12a, 12b, 12c) pre-printed on the substrate (10), and all of the vacuum attached preforms are simultaneously positioned down upon the flux areas of the substrate where they remain when the vacuum is released. Planarity of the thin foil is maintained by a flat somewhat rigid but porous backing member (32) secured to the foil.

Component and solder preform placement device and method of placement

An electrical circuit component is temporarily fixed to a temporary substrate. Electrical contacts on the component are interconnected with corresponding contacts on the test substrate by lead wires or ribbons using a bonding wedge that forms the lead wires into a gull-wing shape with central portions thereof formed adjacent to edge portions of the component. The component is subjected to a test procedure while fixed to the temporary substrate via signals applied to the contacts thereof. The lead wires are then severed near their connection to the temporary substrate, and the component with the remaining lead wire portions attached is removed from the test substrate. The lead wires are sufficiently stiff and/or are adhered to the edge portions of the component with an adhesive so as retain their shapes after removal of the component from the temporary substrate. The component is then adhered to a permanent device substrate, and the ends of the lead wires are bonded to corresponding contacts on the device substrate.

Testable ribbon bonding method and wedge bonding tool for microcircuit

The disc recording cutter head is carried on the inner end of an arm which is pivoted intermediate its ends. A counterbalance weight on the outer end of the arm exactly counterbalances the cutter head. A direct current torque motor mounted on the pivot axis applies cutting force to the cutting stylus. Additional features optionally include damping of arm motion by arm position feedback to the torque motor and control of the cutting force as a function of stereo program material.

Suspension system for disc recording cutter head

Growing community of inventors

Huntington Beach, CA, United States of America

Gerald B Smith