International Business Machines Corporation

Surescan Corporation

Gerald Andrew Kiballa

James Ralph Case

Michael A Shuman

Voya Rista Markovich

Eric A Johnson

Michael Wozniak

Wayne David Klossner

Ronald Joseph Becker

Gary L Newman

Liza Hart

Michael Crocker

Edward Cibulsky

John Francis Prikazsky

A method and device that provides independent temperature control of x-ray detector crystals, either singly or in small groups. In addition to a thermal control network for the crystals, electronic devices are associated with each detector crystal and are independently cooled using Peltier devices so that lifetime and reliability are maximized. In most operating environments the ambient temperature is less than the operating temperature of the detector crystals. In these situations, the heat removed from the electronics can be used to heat the detector crystals, resulting in efficient operation.

Test equipment for verification of crystal linearity at high-flux levels

An improved polishing apparatus having a dampening system to prevent fluctuations between the planar head polishing device and the circuit panel. The dampening system includes a load actuation arm having a hydraulic-pneumatic cylinder which is controlled by an connected dampening circuit.

Chemical planar head dampening system

A system for cleaning clogged orifices of a fluid head includes both apparatus and method by which reverse flow of a cleaning solution is combined with providing the vibrational energy of an ultrasonic frequency generator to the fluid head. A liquid pump and a filter interconnect between the input terminal of a fluid head to be cleaned and the input to the cleaning chamber of the apparatus so that a liquid cleaning solution reverse flushes the clogged fluid head, while the ultrasonic frequency generator is providing vibrational energy to break loose stubborn clogs.

Fluid head cleaning system

A technique for chemically planarizing an exposed surface of metal on a substrate to a pre-determined thickness is provided. The substrate has an exposed metal surface such as copper circuitry on a dielectric substrate which is to be planarized. Typically, this will be circuitization extending above a photoresist layer. A planarizing head is rotated against the substrate, with the planarizing head in contact with the metal surface on the substrate. A chemical etchant, essentially free of abrasive material, is continuously supplied to the interface between the metal surface and the planarizing head. The planarizing continues until a predetermined thickness of the metal has been reached. In circuit board manufacturing, this will form a surface co-planar with the photoresist. In some instances where significant height reduction is required, thus requiring significant metal removal, several passes of the substrate may be required or a device with multiple heads may be used. On all but the last pass or last head, the planarizing head may include a film of polyester impregnated with very fine grit, such as 15.mu. or less silicon carbide (SiC). However, on the final pass or head, a relatively hard surface roll, e.g., rubber, free of added grit, is used to ensure a planar surface free of gouges.

Method and apparatus for polishing metal surfaces

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Owego, NY, United States of America

Gerald Andrew Kiballa