International Business Machines Corporation

Gerald A Bendz

Diana Jean Bendz

Michael J Canestaro

Peter Bakos

Russell E Darrow

James Steven Kamperman

Jeffrey D Jones

Steven L Bard

Jack M McCreary

Dennis L Rivenburgh

Edward Jay Frankoski

Michael S Horan

John R Chapura

John R Kjelgaard, Jr

Anne Marie Wildman

A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occurring within the same housing chamber which serves to collect the first fluid.

Fluid treatment apparatus

A cleaning composition which includes N-methyl-2-pyrrolidone and an alkanolamine, and use thereof for cleaning substrates.

Cleaning composition and use thereof

Organic polymer resist layers are stripped from substrates by treating the layers with a mixture of an aldehyde or a ketone and an alcoholic solution of a compound selected from the group consisting of ammonium, alkali metal, and alkaline earth metal hydroxides and carbonates.

Process for stripping resist layers from substrates

A resist mask, whose configuration is changed during processing, is formed by varying the exposure energy across a resist layer and then conducting successive development steps using developers having increasing solvent power to remove progressively more of the resist layer with each step.

Resist process

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Vestal, NY, United States of America

Gerald A Bendz