Tel Epion Corporation

Tel Nexx, Inc.

Georgiy Seryogin

Stephen N Golovato

Thomas G Tetreault

Ramya Chandrasekaran

Techniques disclosed herein a method and system for conditioning a polymeric layer on a substrate to enable adhesion of a metal layer to the polymeric layer. Techniques may include conditioning the polymeric layer with nitrogen-containing plasma to generate a nitride layer on the surface of the polymeric layer. In another embodiment, the conditioning may include depositing a CuN layer using a lower power copper sputtering process in a nitrogen rich environment. Following the condition process, a higher power copper deposition or sputtering process may be used to deposit copper onto the polymeric layer with good adhesion properties.

Growing community of inventors

Watertown, MA, United States of America

Georgiy Seryogin