Corning Incorporated

Medtronic, Inc.

Picosys Incorporated

Invenios Inc

Other

Corning Research & Development Corporation

Invenias Inc

Georges Roussos

Raymond Miller Karam

David A Ruben

Michael S Sandlin

Thomas M Wynne

Mark Finkle

Pascal R Ackermann-Karam

Anthony Thomas Chobot

Daniella M Harvey

Nicholas Francis Borrelli

Joseph Francis Schroeder, Iii

Davide Domenico Fortusini

Shawn Michael O'Malley

Jun Yang

Raymond M Karam, Ii

Lei Yuan

Amy Renee Andersen

Brian Nilsen

Vijay Albuquerque

Yu-Yen Huang

Danielle M Harvey

Ramond Miller Karam

Tony Chobot

Rob Hobden

John Koons

Pascal R Ackerman-Karam

Bulk materials having a kinetically limited nano-scale diffusion bond is provided. The bulk materials having a kinetically limited nano-scale diffusion bond includes transparent material, absorbent opaque material and a diffusion bond. The transparent material has properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption. The absorbent opaque material has properties that significantly absorb energy from the electromagnetic beam. The diffusion bond is formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material. Moreover, the diffusion bond has a thickness that is less than 1000 nm.

Kinetically limited nano-scale diffusion bond structures and methods

The present disclosure relates to a method of making a lensed connector in which a glass ferrule has holes within the body of the glass ferrule, and the glass ferrule is subsequently processed to form lens structures along the ferrule.

Method of making a lensed connector with photosensitive glass

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding

A flow cell incorporates a first substrate with a metal layer on one surface. A tape layer having flow channels is adhered to the first substrate. A second substrate having a second metal layer on one surface is adhered to the tape layer opposite the first substrate. At least one of the first and second metal layers includes mating cutouts to at least partially expose the flow channels.

Method and apparatus for taped interlayer flow cell with masking

Embodiments generally relate to methods for preventing the formation of an emulsion in a liquid lens. In one embodiment, the method comprises fabricating a top substrate, a bottom substrate, and a central substrate including a cavity configured to be filled by first and second liquids. The liquid lens comprising the top substrate, the bottom substrate and the central substrate is assembled, with at least one of the top substrate and the bottom substrate in the assembled liquid lens being characterized by a stabilizing feature determining that in response to an impact load on the assembled liquid lens that would cause localized pressure drops of maximum magnitude X in the absence of the stabilizing feature, the maximum magnitude of localized pressure drops within the liquid lens is smaller than X.

Method to prevent emulsion in a liquid lens

Method and apparatus for taped interlayer flow cell with masking and conductive traces

Embodiments generally relate to methods for bonding a cap to a substrate. In one embodiment, the method comprises first providing a ring-cap assembly, comprising a cap and an interposer ring comprising a ring material transparent at an illumination wavelength. A peripheral portion of the ring projects outwards beyond the overlying cap. The portion of the ring bottom surface underlying the projecting peripheral portion of the ring comprises a plurality of downwardly extending fingers. The method further comprises positioning the ring-cap assembly so that the plurality of fingers directly overlies predetermined portions of the substrate top substrate, creating a first bond between a first one of the plurality of fingers and a corresponding first predetermined portion of the substrate top surface, while illuminating and observing the first predetermined portion at the illumination wavelength through the projecting peripheral portion of the ring to determine a quality measure of that first bond.

Attachment of a cap to a substrate-based device with in situ monitoring of bond quality

A method of fabricating a liquid lens array creates an array of through holes of axisymmetric cross-section through a central plate, forms conductive traces on the side walls of each of the through holes and on a portion of the top and bottom surfaces of the central plate contiguous with each through hole, and bonds the bottom surface of the central plate around each through hole to the top surface of a transparent base plate, forming an array of cavities. The method applies an insulating layer to the side walls of each cavity, portions of the top surface of the base plate lying within each cavity, and portions of the top surface of the transparent central plate surrounding each cavity, introduces a polar liquid and a non-polar liquid into each cavity; and bonds the top surface of the central plate to the bottom surface of a transparent top plate.

Liquid lens arrays

Fabrication of liquid lens arrays

Growing community of inventors

San Jose, CA, United States of America

Georges Roussos