Motorola Corporation

Freescale Semiconductor,inc.

George W Marlin

Robert E Stengel

Douglas G Mitchell

Douglas H Weisman

Ronald C Alford

Glenn D Raskin

Michael J Pfeifer

A structure and method for achieving a flip-chip semiconductor device having plated copper inductors (), transformers (), interconnect, and power busing that is electrically superior, lower cost, and provides for higher quality inductors as well as lower losses for on-chip transformers. Providing a solder dam () enables the fabrication of flip-chip solder bumps directly on to inductors and transformers.

Flip-chip structure and method for high quality inductors and transformers

A method of manufacturing a solder bump on a power copper structure and resultant device is disclosed. In the method, a layer of an electrically conductive, non-wettable material such as TiW is applied over a power copper structure. Then, solder bumps are formed on the non-wettable layer. The presence of the non-wettable layer prevents the collapse of the solder bumps when heated.

Flip chip device and method of manufacture

A three-dimensional inductor coil is fabricated on top of a semiconductor substrate. The fabrication process includes the steps of depositing a first photoresist layer (406), forming a trench therein, and filling the trench with electroplated metal (404). A second photoresist layer (408) is deposited, and first and second trenches (410) are formed therein and filled with electroplated metal (412). A third photoresist layer (416) is deposited and a trench (418) formed therein, and then filled with electroplated metal (420). The first, second, and third photoresist layers (406, 408, 416) are then removed to expose a multi-loop inductor coil (500, 550).

Method of forming a three-dimensional integrated inductor

Flip chip bumps (24, 26, and 27) and an inductor (17) are simultaneously fabricated on a semiconductor substrate (10). The fabrication process includes two electroplating steps. The first step electroplates copper (18) onto a seed layer (13) to form the inductor (17) and a first portion (16) of the flip chip bumps (24, 26, and 27). The second step electroplates copper (21) onto the previously electroplated copper (18) to form a second portion (21) of the flip chip bumps (24, 26, and 27).

Growing community of inventors

Phoenix, AZ, United States of America

George W Marlin