Motorola Corporation

Amersham Biosciences Ab

Semiconductor Components Industries, LLC

George W Hawkins

Israel A Lesk

Ronald E Thomas

Howard M Berg

Mark W McGarry

Michael John Seddon

Michael B McShane

James H Knapp

James J Casto

Prosanto K Mukerji

James W Sloan

Laura J Norton

Hassan Pirastehfar

Peter A Kahn

Scott C Bolton

Steven J Adler

Rajesh Srinivasan

Sankaranarayanan Ganesan

Gary L Lewis

James M Rugg

W Travis Johnson

Jay J Liu

Colin B Bosch

William L Hunter

Todd Tuggle

Michael L Mitchell

Peter L Pegler

Nikolai Osipenko

Robert Goldstein

Method and apparatus for performing biological reactions on a substrate surface

The present invention provides an apparatus for performing biological reactions on a substrate layer having a multiplicity of oligonucleotide binding sites disposed thereon. The invention provides a hybridization chamber wherein nucleic acid hybridization is performed by reacting biological material on a biochip comprising a substrate having an array of oligonucleotide binding sites. The binding sites are associated with an array of 3-dimensional polyacrylamide pads for anchoring the reactants. The arrays are covered with a flexible layer that permits mixing of the hybridization solution on the biochip and detection of hybridization in situ. Fluid inlet and outlet ports in the chamber provide for control of fluid flow into and out of the chamber.

The present invention provides a method and an improved apparatus for removing gas bubbles from a reaction chamber comprising a flexible layer removably affixed to a substrate layer having a multiplicity of oligonucleotide binding sites disposed thereon, in which biological reactions are performed. The invention specifically relates to methods and apparatus for removing gas bubbles from a reaction chamber wherein target molecules contained in a sample fluid are reacted with probe molecules immobilized on a substrate having an array of oligonucleotide binding sites. The arrays are covered with a flexible, gas permeable layer that permits mixing of the sample fluid on the biochip and removal of gas bubbles from the fluid by use of a means for facilitating diffusion of gas bubbles across the flexible, gas permeable layer.

A semiconductor component includes a semiconductor chip (,) having first and second surfaces opposite each other, a semiconductor device (,) in the semiconductor chip (,), and a flexible substrate (,) packaging the semiconductor chip (,).

Flexible substrate for packaging a semiconductor component

An electronic device in a cavity in a mold is encapsulated by a composite plastic having two materials placed, respectively, in sequential locations in a reservoir in the mold. The first material has desirable properties when in contact with the surface of the device, e.g., better adhesion. The second and different material has other desirable properties, e.g., mechanical strength, low moisture permeability, etc. The first location is first in line in a direction through the mold chambers to the cavity. The two-part encapsulant is injected into the cavity without significant turbulence so as to avoid much mixing of the two materials. This creates a boundary layer of the first material which preferentially applies a coating to the device while the second material substantially fills the bulk of the space in the mold cavity. A composite encapsulation is formed having overall superior properties.

Encapsulation means and method

An electronic component includes a substrate (11) having a device surface (13) and opposite ends (14, 15) adjacent to the device surface (13), an electronic device (16) supported by the device surface (13), and an interconnect substrate (30) overlying a first end (14) of the substrate (11) and electrically coupled to the electronic device (16). The electronic component can be manufactured by inserting the second end (15) of the substrate (11) into one of a plurality of holes (23) in a carrier (20) wherein the device surface (13) and the carrier (20) form an angle greater than approximately five degrees.

Method of manufacturing an electronic component

A method for making moisture resistant semiconductor devices having organic substrates targets each of the potentially critical interfaces within a semiconductor device having the potential for delamination and cracking. An organic substrate (110) is designed to include a solid pad (116) having a chemically created oxide layer (118) formed thereon. A silicone-based die attach material (108) is dispensed and gelled very soon after dispensing to prevent excessive bleed. A semiconductor die (102) is mounted to the substrate after undergoing a cleaning operation to remove contaminants from the backside of the die. Prior to molding compound encapsulation and subsequent to die attach material cure, the substrate is cleaned to improve adhesion to the die attach material fillet (122). In practicing these operations, the following interfaces are targeted and their adhesion characteristics are improved: die attach material to die pad; die attach material to die; molding compound to die pad; and molding compound to die attach material.

Method for making a moisture resistant semiconductor device having an

Electronic component having an interconnect substrate adjacent to a side

A method for gettering metallic impurities from a semiconductor substrate (25). A gettering structure is fabricated in inactive areas of a semiconductor chip (31). The gettering structure is manufactured by forming an oxide (30) having a bird's head structure contacting a heavily doped region (28). The combination creates precipitation nuclei to which the metallic impurities migrate. The metallic impurities are sequestered by the precipitation nuclei or trap sites and rendered incapable of degrading the electrical characteristics of a semiconductor device.

Method of making a structure for top surface gettering of metallic

A semiconductor chip is flip chip bonded to a substrate having a cavity or a through hole formed therein. The cavity or through hole is preferably large enough to substantially remove the narrow gap which is formed between the portion of the substrate which does not have the cavity or through hole formed therein. This allows for use of mold processes to encapsulate and underfill the semiconductor chip and for line of sight cleaning of the semiconductor chip after bonding.

Semiconductor chip bonded to a substrate and method of making

An improved semiconductor die for plastic encapsulated semiconductor device packages which impedes the inherent delamination caused by the differing expansion coefficients of the semiconductor die and plastic encapsulation. Rounded or tapered die corners and die edges decrease the stress from the plastic encapsulation that acts upon the semiconductor die. This reduced stress slows the delamination progression and leaves the operational circuitry unaffected for an increased period of time thereby increasing device lifetime.

Semiconductor die having rounded or tapered edges and corners

A secure answering machine allows both secure and non-secure information to be recorded by incorporating a digital signal processor (DSP) and both a secure and non-secure RAM. The secure RAM is powered entirely by battery. The battery is then connected to the housing of the answering machine such that when the housing is tampered with, the power from the battery is shut off eliminating all information stored on the secure RAM. The secure RAM is only accessed using an encrypting code.

Secure mode answering machine

A semiconductor package wherein a semiconductor die is disposed in packaging material and electrically coupled to leads having portions extending from the packaging material. The portions of the leads that extend from the packaging material are adhered to the outside of the packaging material and release therefrom when subjected to a predetermined amount thermal stress. The invention disclosed herein allows consistent alignment of flexible leads while adequately reducing stress caused by the differing coefficients of thermal expansion of the semiconductor package and a printed circuit or the like on which the package is mounted.

Semiconductor package having leads that break-away from supports

An improved semiconductor die for plastic encapsulated semiconductor devices which impedes the inherent delamination caused by the differing expansion coefficients of the semiconductor die and plastic encapsulation. Topological configurations are processed in the die corners of the semiconductor die which are void of circuitry. The topological configurations act as barriers and slow the delamination progression. This leaves the operational circuitry unaffected for an increased time thereby increasing device lifetime.

Die corner design having topological configurations

A molded semiconductor package having a flagless leadframe wherein a semiconductor die is disposed in or above a die opening of a leadframe. This allows for thin, symmetrical packages and packages having a minimum number of material interfaces to be manufactured because no leadframe flags and minimal die bond material are employed. The present invention further includes guard rings to protect high stress areas of the semiconductor die from damage and heat spreaders to more effectively spread heat dissipated by the semiconductor die.

Growing community of inventors

Mesa, AZ, United States of America

George W Hawkins