International Business Machines Corporation

George T Galyon

Roger R Schmidt

Prabjit Singh

Randall G Kemink

Steven J Mazzuca

George M Jordhamo

Michael Lynn Zumbrunnen

Jeffrey A Newcomer

Kevin P Moran

Louis H Wirtz

Frank E Bosco

King M Chu

Lenas J Hedlund

Yiping Yao

Victor A Ronken

An exemplary embodiment is a system and method for a device reliability test circuit. The method includes applying a DC voltage across the device for a period, wherein the DC voltage is less than the rated voltage of said device, and determining a failure point of the device based on applying the DC voltage.

System and method for a device reliability and test circuit

A power supply to be tested is placed in a vacuum chamber; the power supply is turned on and gas pressure in the chamber is reduced. As the gas pressure is reduced below 1 atmosphere, the breakdown voltage decreases; when the breakdown voltage decreases to the value of the applied voltage, arcing occurs as long as the applied voltage is greater than a minima. When a site arcs, the site is noted; the power supply is removed from the vacuum chamber; the arc site is conformally coated and the coated cured. Thereafter, the power supply is returned to the vacuum chamber and the test process repeated until the power supply no longer arcs. Thus the partial pressure test can identify the sites that have a possibility of arcing in the field and the design of the power supply modified by use of one or more conformal coatings or by otherwise changing the configuration of the power supply.

Prevention of arcing in power supplies

A semiconductor device, full bridge converter employing the same, and methods of fabrication thereof are provided. The device includes a vertical MOSFET having a parasitic body diode at a junction face between a body region and a semiconductor layer thereof. The parasitic body diode is suppressed by having no direct electrical connection to the body region, resulting in the parasitic body diode being open-circuited within the MOSFET. Co-packaged with the MOSFET is a separate bypass diode connected across a source and a drain of the MOSFET. The bypass diode functions to clamp the voltage across the MOSFET without employing the parasitic, electrically isolated body diode of the MOSFET.

Power MOSFET device, structures employing the same and methods of fabrication

A method of cooling electronic devices in an electronic assembly is proposed where the said assembly has at least one board that houses electronic modules. The methodology comprises shaping a light weight plate with apertures as to compliment the geometric shape of the assembly and board to be cooled; affixing coolant passage tubes in the apertures of the plate and finally cooling the electronic assembly by placing the assembly in thermal contact with the plate and passage tubes after a coolant is introduced in the passages.

Method of cooling electronic devices using a tube in plate heat sink

A specially designed cooling device is proposed comprising of a light weight plate with apertures. Thin walled coolant passage tubes are provided in the apertures for the passage of a coolant. The coolant passages are made out of a material, preferably different than the plate itself and are to provide better heat dissipation than the plate and also prohibit liquid leakage. The cooling device is specially designed to accommodate an electronic assembly's geometry.

Tube in plate heat sink

A method and apparatus in which an aluminum-clad copper pin-piston is supported on the upper surface of a roller or a pair of rollers. As the roller rotates, it rotates the pin-piston and the surface of the roller carries an electrolyte. The positive side of a power supply is connected to the pin-piston and the negative side of the supply is coupled to the roller surface via the electrolyte bath. Anodizing current passes from the rotating roller to the rotating pin-piston via the electrolyte, which is continuously replenished. An anodized film forms on the aluminum surface of the pin-piston. Oxide growth rate and film thickness are controlled by controlling the current density and the duration of pin-piston contact with the charged roller.

Continuous anodizing of a cylindrical aluminum surface

A cold plate and an integrated circuit cooling module embodying a cross-hatch coolant flow distribution scheme. Cross hatch flow distribution is achieved by way of two sets of channels which run perpendicular to each other. The first set of channels is formed on a base plate. The second, perpendicular set is includes a set of inlet channels and a set of interleaved outlet channels formed on a distribution plate. In the preferred embodiment, the base and distribution plates are separated by an interposer plate that has nozzles which cause a liquid coolant to impinge, under pressure, on the floor of the base plate.

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Fishkill, NY, United States of America

George T Galyon