Universal Instruments Corporation

Delaware Capital Formation, Inc.

George Russell Westby

Laurence A Harvilchuck

Wilhelm Prinz Von Hessen

Peter Borgesen

Apparatus and method to aid in the reproducible and reversible tensioning of flexible substrates, such as polyimide or other file, to ensure planarity before, during, and after processing while mounted in tensioning apparatus.

Flexible substrate tensioner

A substrate carrier system is provided for physical management of substrate(s) during a variety of assembly techniques performed on the both sides of the substrate(s) without dismounting or changing carrier systems.

Substrate carrier system

A flip chip having a chip passivation layer disposed on a metalization layer. Terminal vias are formed in the passivation layer exposing a portion of the metalization layer and terminal metalization is disposed on the metalization layer at the terminal vias. A stress reducing layer is disposed on the chip passivation layer with underfill apertures formed in the stress reducing layer so as to expose selected portions of the chip passivation layer, thereby enhancing the adhesion of an underfill material to the flip chip.

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Owego, NY, United States of America

George Russell Westby