Texas Instruments Corporation

George Reeves

Rex Warren Pirkle

Sean Michael Malolepszy

Floyd F Schemmel

Todd D Stubblefield

Eugene Tudor Gharis

Michael W Perry

Curtis L Harbert

Troy W Hoehner

Embodiments of the present disclosure provide a routing engine, a method of routing a test probe and a testing system employing the router or the method. In one embodiment, the routing engine is for use with a test unit having at least one test probe and includes an analysis unit configured to analyze alternative test probe routing sequences that employ representative circuit chips of a semiconductor wafer to be tested by the test unit. The routing engine also includes a selection unit configured to select at least one of the test probe routing sequences as a test probe path for testing the semiconductor wafer based on a total cost of travel for the test probe path.

Routing engine, method of routing a test probe and testing system employing the same

A method of selective trim and wafer testing of precision integrated circuits is provided by determining if a sample die is within specification. If so the sample parameters are measured and if the die passes the sample parameters the die is good and repeat the steps of determining if the die is within specification and measuring the sample parameters until a die fails the measurement test or requires a trimming and if a die fails a measurement test or requires trimming perform 100 percent test and trim.

Selective trim and wafer testing of integrated circuits

Multiprobe blob test in lieu of 100% probe test

A system for determining a position error in a wafer handling device includes a control module, an image acquisition module, and an image analysis module. The control module moves a workpiece having one or more reference marks, and the image acquisition module captures an image of at least one reference mark. The image analysis module, which is coupled to the image acquisition module, compares the captured image to stored target information to determine a position error.

System and method for determining a position error in a wafer handling device

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Sherman, TX, United States of America

George Reeves