The Texas A&m University System

The United States of America As Represented by the Administrator of the

George P Peterson

Leroy S Fletcher

Charles J Camarda

Donald R Rummler

Sevgin Oktay

Mark H Weichold

Arnab K Mallik

Flat or curved micro heat pipe panels are fabricated by arranging essentially parallel filaments in the shape of the desired panel. The configuration of the filaments corresponds to the desired configuration of the tubes that will constitute the heat pipes. A thermally conductive material is then deposited on and around the filaments to fill in the desired shape of the panel. The filaments are then removed, leaving tubular passageways of the desired configuration and surface texture in the material. The tubes are then filled with a working fluid and sealed. Composite micro heat pipe laminates are formed by layering individual micro heat pipe panels and bonding them to each other to form a single structure. The layering sequence of the micro heat pipe panels can be tailored to transport heat preferentially in specific directions as desired for a particular application.

Method for producing micro heat panels

Micro heat pipe panels and method for producing same

A catheter that provides precise temperature control is disclosed herein. The catheter may use a variety of passive heat pipe structures alone or in combination with feedback devices. The catheter is particularly useful for treating diseased tissue that cannot be removed by surgery.

Temperature control mechanisms for a micro heat pipe catheter

A micro-heat-pipe catheter provides a hyperthermia or hypothermia source for the treatment of cancerous tumors or other diseased tissue. The heat-pipe is about the size of a hypodermic needle and is thermally insulated along a substantial portion of its length. The heat-pipe includes a channel, partially charged with an appropriate working fluid. Active or passive heat control tailors the delivery or removal of thermal energy directly to or from the tumor or diseased tissue site.

Micro-heat-pipe catheter

A micro heat pipe, formed in a semiconductor substrate, carries heat from a region of heat flux in the substrate to a region of lower heat flux. The micro heat pipe is formed by cutting a groove into the substrate opposite a site where devices have been formed or are to be formed. Vapor deposited layers are then formed on the substrate to define the micro heat pipe. A fraction of the pipe is filled with a coolant or other working fluid and the pipe is sealed. A micro heat pipe may also be formed by etching a channel down into the substrate, oxidizing the surfaces of the channel, charging the channel with a cooling medium to fill a fraction of the channel and sealing the end of the channel. In operation, the working fluid evaporates in the region of high heat flux and condenses in the region of lower heat flux resulting in the transfer or redistribution of the fluid's heat of vaporization.

Vapor deposited micro heat pipes

A heat transfer method and apparatus are disclosed for transferring heat across a cylinder surface, in order to maintain the cylinder surface at a uniform temperature for drying, rolling or otherwise processing a work piece. The apparatus comprises a rotatable cylinder wall with a plurality of heat pipes bent near their evaporator ends and disposed within and around the periphery of the cylinder wall, at least one end wall, and a plurality of hubs interconnecting the cylinder with a drive shaft. The heat transfer cylinder, itself, may comprise a large rotating heat pipe.

Heat transfer cylinder

A bellows type heat pipe which conducts heat away from an electronic device to a heat sink. The heat pipe is a sealed bellows type container which has an evaporator section at one end and a condenser section at an opposite end. The evaporator section contains a saturated radial wick while the condenser section is lined with a radial wick and a circumferential wick. A corrugated slab wick is longitudinally disposed within the heat pipe interconnecting the evaporator and the condenser sections. The evaporator section is placed on the electronic device and the condenser section is enclosed in a housing which is connected to a heat sink. In operation, the electronic device generates heat energy which causes the fluid in the evaporator to vaporize building a vapor pressure in the heat pipe. The heat pipe expands in the direction of the condenser causing the condenser section to make intimate contact with the inside of the housing. The vapors condense at the condenser section and are brought back to the evaporator section via the circumferential wick, the walls of the bellows vessel and the wick slab.

Growing community of inventors

College Station, TX, United States of America

George P Peterson