Hughes Aircraft Company

George P Pelzman

Hal D Smith

Joon B Park

Robert F McClanahan

Joseph M Jacobs

Andrew A Shapiro

Han C Leung

Stanley Taketani

Apparatus for blanking and collating a plurality of individual pyrolyzable sheets having electrical circuit patterns formed thereon from an integral pyrolyzable sheet having the electrical circuit patterns for the individual sheets printed thereon, where the individual pyrolyzable sheets comprise layers of a hybrid module. The apparatus includes a die having substantially identically sized openings for supporting the integral printed pyrolyzable sheet, a punch assembly engageable with the die for blanking the integral printed pyrolyzable sheet into a plurality of substantially identically sized sheets having electrical circuit patterns formed thereon, and a collation structure located beneath the means for receiving the blanked sheets from the die and for stacking the blanked sheets.

HTCC/LTCC substrate blanker/multi-layer collation die

Die punch apparatus including an electromagnetic die head core having a plurality of punch die retaining apertures, a plurality of magnetically attractable die punch assemblies respectively retained in the plurality of die retaining apertures, and a receiver plate core having punch receiver assemblies for receiving the punch pins of the punch die assemblies.

Magnetic punch die retention for HTCC/LTCC fabrication

A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, the capacitor structure including a dielectric via fill in a via formed in one of the insulating layers, a first conductive element overlying the dielectric via fill, and a second conductive element underlying said dielectric via fill. Each of the first and conductive elements comprises a conductive via fill or a conductive trace.

Via capacitors within multi-layer, 3 dimensional structures/substrates

The base (12) of the fixture apparatus carries four fingers (22)-(28) which define the top plane of the printed wiring board (14). The fingers move out of active position to permit placement of the board in a frame (16). The frame rests on lifter assemblies (46-52) which raise the printed wiring board into contact with the fingers.

Growing community of inventors

El Segundo, CA, United States of America

George P Pelzman