Materion Gmbh

Target Technology Company, LLC

Academy Corporation

Materion Advanced Material Technologies and Services Inc.

George Michael Wityak

Richard J Koba

Luther Wilburn Cox

Christopher A Johnson

James W Ridout

Alan Duckham

A light emitting diode with a front surface adapted to emit light and a rear surface is provided with a reflective coating on the rear surface, the reflective coating being primarily silver and containing either 0.4% bismuth or a combination of 0.5% tin, 0.2% copper, and 0.2% samarium.

Light emitting diode

A rotary deposition target bonded to a backing tube such that the bonding material is applied only at the ends of the rotary target to form a gap between the rotary target and the backing tube to enable a target cooling fluid used during the deposition process to contact the target directly and to provide a hermetic seal to contain the cooling fluid within the gap and prevent the fluid from being exposed to the environment within the deposition chamber.

Direct cooled rotary sputtering target

A high thermal conductivity base plate is provided for use in air cavity packages. The base plate is at least partially comprised of a composite made of silver-diamond or a silver alloy-diamond. In some embodiments, the base plate is entirely comprised of the composite. In other embodiments, the base plate has a core made of the composite. The core can include at least one outer layer on the core. The semiconductor package can include one or more dice or transistors on the base plate, an insulated frame on the base plate, and one or more leads on the insulated frame.

Air cavity packages having high thermal conductivity base plates and methods of making

Semiconductor packages are provided that have a base plate with a matrix of pure silver or a silver alloy and reinforcement particles. The reinforcement particles can include high thermal conductivity, low CTE particles selected from the group consisting of diamond, cubic boron nitride (c-BN), silicon carbide (SiC), and any combinations thereof. In some embodiments, the base plate is entirely comprised of the composite. In other embodiments, the base plate has a core made of the composite. The core can include at least one outer layer on the core. The semiconductor package can include one or more dice or transistors on the base plate, an insulated frame on the base plate, and one or more leads on the insulated frame.

Semiconductor packages having metal composite base plates

A rotary sputtering target bonded to a backing tube such that the bonding material is applied only proximate the ends of the rotary sputtering target and is also between the target and the backing tube to form a gap between the rotary sputtering target and the backing tube and a device for bonding a rotary sputtering target to a backing tube.

Rotary target backing tube bonding assembly

A silver-based alloy composition for use as a reflective, semi-reflective or highly reflective coatings or layer(s) for use in optical data storage media, low emissivity glass, transparent conductive displays, and electro-chromic mirrors, or other reflective, semi-reflective or highly reflective applications. The alloy compositions comprise silver with hafnium, and/or indium, and/or copper, and/or zinc, and/or silicon and/or tin.

Reflective or semi-reflective metal alloy coatings

A target-backing plate assembly for use in physical vapor deposition (PVD) processes. The lower curved surface of the target of the assembly is received in a conformingly-shaped backing plate, while a planar upper surface is presented for PVD. The shape of the target increases the amount of material dissipated and the quality of the film and reduces the amount of necessary machining in production.

Growing community of inventors

Albuquerque, NM, United States of America

George Michael Wityak