International Business Machines Corporation

North Carolina State University

George M Moorefield, Ii

Mark Anthony Church

Alain M Desouches

Christopher Arcona

Daniel Paul Kelaher

Richard M Barina

Derek Ian Schmidt

James Scott Womble

James Robert Drake

Thomas A Dow

Kenneth P Garrard

John Patrick Hagen

Thomas Donald Weller

Terry Fredrick Banitt

Carl Francis Sermon

Lauren W Taylor

Roger Willard Johnson

A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.

Tool for installation and removal of semiconductor device

A lapping plate topography system includes a measuring apparatus for measuring the surface of a lapping plate, and an analysis apparatus for analyzing and presenting the data resulting from such measurements. The measurement apparatus has a non-contacting capacitive probe for measuring a height of the surface of the lapping plate, a rotary arm assembly for moving the probe in an arc over the surface of the lapping plate, and a spindle assembly for rotating the lapping plate about its center. The computer-based analysis apparatus is operable to input from the measurement apparatus the measured height at a plurality of data points on the surface of the lapping plate, calculate Fourier transform harmonic coefficients based on the plurality of measured heights, calculate surface ripple coefficients based on the calculated Fourier transform harmonic coefficients, and output the calculated surface ripple coefficients to an appropriate display device.

Lapping plate topography system

A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.

Bow compensated lapping

A turning machine includes a controller for generating both aspherical and non-symmetrical shape components defining the predetermined shape, and a controller for controlling a spindle and a positionable cutting blade to thereby form a predetermined non-rotationally symmetric shape in a workpiece surface. The apparatus includes a rotatable spindle for rotatably mounting the workpiece about an axis, a spindle encoder for sensing an angular position of the rotating workpiece, the cutting blade, and radial and transverse positioners for relatively positioning the cutting blade and workpiece along respective radial and transverse directions. The controller cooperates with a fast transverse positioner for positioning the cutting blade in predetermined varying transverse positions during a revolution of the workpiece.

Apparatus and method for forming a workpiece surface into a

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Research Triangle Park, NC, United States of America

George M Moorefield, Ii