International Business Machines Corporation

George Liang-Tai Chiu

Keith E Fogel

Paul Alfred Lauro

Russell Alan Budd

Brian Samuel Beaman

Lawrence Shungwei Mok

Minhua Lu

Richard Alan Haight

Steven Alan Cordes

Thomas Mario Cipolla

Hiroki Nakano

James Patrick Doyle

Michael Philip Goldowsky

John Harold Magerlein

Daniel Peter Morris

Matthew J Farinelli

Ronald Wayne Nunes

James Vichiconti

Arthur Wood Ellis

Sung-Kwon Kang

Da-Juan Shih

A Thermal Interface Material ('TIM') composition of matter with improved heat conductivity comprises solderable heat-conducting particles in a bondable resin matrix and at least some of the solderable heat-conducting particles comprise a solder surface. Positioning the TIM between a first surface having a solder adhesion layer and a second surface, and then heating it results in soldering some of the solderable heat-conducting particles to one another; and some to the solder-adhesion layer on the first surface as well as adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device, e.g., a semiconductor device and the second surface a heat sink, such as a solderable heat sink. A product comprises an article of manufacture made by the process.

Multipath soldered thermal interface between a chip and its heat sink

In a liquid crystal display device, a method for creating desirable pretilt angle by means of topography of the substrates, such as a surface that is sloped with respect to the surface of the electrodes. In combination with a low pretilt but highly photo-stable alignment layer, which may be very resistant to high levels of ultraviolet radiation, a high pretilt and photo-stable alignment structure is generated, by essentially combining two incompatible technical approaches. The ever more stringent requirements for projection displays are met. The methods for producing such sloped surfaces and the considerations related to design of the sloped surfaces are disclosed.

Method of producing UV stable liquid crystal alignment

A probe or an electrical connector comprises a substrate with a surface having a plurality of electrical contact locations. A shaped elongated electrical conductor has a first end coupled to one of the electrical contact locations and a second end thereof which projects away from the electrical contact location and through an aperture in a sheet of material. The sheet is disposed to be spaced apart from the surface of the substrate. At the second end of the elongated electrical conductor there is a tip structure, which is larger than the aperture in the sheet of material. The tip structure has a pointed portion thereof. The tip structure is disposed against contact locations of a contact surface. The electronic structure is moved towards the contact surface permitting the tip structure to penetrate into the surface of the electrical contact location thereon and to move, wipe, or vibrate across the surface thereof as the shaped elongated electrical conductor flexes as a result of being compressed by the movement of the electronic structure toward the contact surface.

Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof

An OLED device which is capable of utilizing light transmitted from the sides of the OLED as well as the surface of the OLED is provided. The OLED device comprises an OLED having a substrate surface and sides for emission of photons therethrough and at least one adjacent light-folding means, wherein said light-folding means collects and redirects photons emitted from the sides of the OLED into coincident paths of light which are substantially parallel to said photons emitted from said substrate surface.

Highly efficient OLED device

A semiconductor or dielectric wafer with conducting vias is used as a substrate in an integrated circuit packaging structure, where high density inter and intra chip contacts and wiring are positioned on the substrate face on which the integrated circuitry is mounted, and external signal and power circuitry is contacted through the opposite face. Use of a substrate such as silicon permits the use of conventional silicon processes available in the art for providing high wiring density together with matching of the thermal expansion coefficient of any silicon chips in the integrated circuits. The use of vias through the substrate allows a high density of connections leaving the silicon substrate and provides short paths for the connections of power and signals.

System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face

A stand for a portable personal computer including a base including a front side, a back side, a right side, a left side, and a bottom surface. The stand includes at least one stand member interconnectable with the base. The at least one stand member is positionable in a deployed position and a stowed position. In the deployed position the at least one stand member supports at least one portion of the bottom surface of the base at an elevated level with respect to a surface that the portable personal computer is supported by. The at least one stand member engages a surface of the base in the stowed position.

Portable computer stand for enhanced cooling

A hermetic pump includes a housing having a bore, an inlet, and an outlet for channeling a fluid therethrough. A shaft is disposed coaxially in the bore, and includes a journal and an impeller spaced apart therefrom. The shaft is hermetically rotated to pump the fluid through the bore from the impeller and around the journal for developing a hydrodynamic journal bearing. In one embodiment, the pump may be used in a closed loop cooling circuit.

Contactless hermetic pump

Growing community of inventors

Cross River, NY, United States of America

George Liang-Tai Chiu