Lexmark International, Inc.

International Business Machines Corporation

Funai Electric Company Ltd.

George Keith Parish

Kristi Maggard Rowe

Frank Edward Anderson

John Glenn Edelen

Bruce David Gibson

Robert Wilson Cornell

John Philip Bolash

Yimin Guan

Randall David Mayo

Mark Joseph Edwards

David Golman King

Byron Vencent Bell

Lucas David Barkley

Lawrence Russell Steward

Paul W Graf

William Paul Cook

James Harold Powers

Adam Jude Ahne

Carl Edmond Sullivan

Edmund Hulin James, Iii

Timothy Lowell Strunk

Thomas Jon Eade

John Dennis Zbrozek

Eric Spencer Hall

David Craig Stevenson

Jim Michael Mrvos

Susan Marie Zearfoss

William M Johnson

Steven Wayne Bergstedt

Kent Lee Ubellacker

Shirish Padmaker Mulay

Thomas Austin Fields

William Joseph Thornhill

John Douglas Anderson

Paul Albert Cook

Jan Richard DeMeerleer

Stephen Andrew Budelsky

J Glenn Edelen

Robert Edward Miller, Jr

David Howard White

David Steven Waldrop

Rick L Hubert

Krisit M Rowe

Robert Shelby Tucker

A micro-fluid ejecting head for use in a micro-fluid ejecting apparatus includes a plurality of micro-fluid ejection devices, a plurality of driver devices for driving the plurality of micro-fluid ejection devices, and a nonvolatile programmable memory matrix. The memory matrix contains embedded programmable memory devices for storing information related to operation of the micro-fluid ejecting head. The memory matrix is configured to communicate with a controller which is external of the micro-fluid ejecting head. The information stored in the memory matrix may include identification information for the micro-fluid ejecting head, alignment characteristics of the micro-fluid ejecting head, information regarding properties of fluid used by the micro-fluid ejecting head, fluid level information, and fluid use information. The external controller accesses the information stored in the memory matrix and controls the plurality of driver devices based on the information accessed from the memory matrix.

Micro-fluid ejecting device having embedded memory in communication with an external controller

A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

Method for making a thin film resistor

An inkjet printhead. The inkjet printhead includes a temperature-sensing resistor with a low voltage end which is connected to a ground structure that at least partially encloses the temperature sensing resistor.

Ground structure for temperature-sensing resistor noise reduction

A micro-fluid ejection head and method for reducing a stagger pattern distance and improving droplet placement, on a receiving medium. The micro-fluid ejection head includes a substrate containing a plurality of ejection actuators on a device surface thereof and a fluid supply slot for providing fluid to be ejected by the micro-fluid ejection head. The ejection head also includes a flow feature component in flow communication with the fluid supply slot and configured for providing fluid ejection chambers and fluid supply channels for the fluid ejection chambers. Adjacent first and second ejection actuators in a substantially linear array of ejection actuators are each spaced a first distance from the fluid supply slot and second and third ejection actuators in the linear array of ejection actuators are each spaced a second distance from the fluid supply slot that is less than the first distance.

Micro-fluid ejector pattern for improved performance

Printheads configured to operate in accordance with a plurality of print modes. For example, one of the plurality of print modes can be selected in accordance with a bit of address data received by the printhead. In an exemplary embodiment, the selection of print mode can be accomplished by switching one or more actuator (e.g., heater) circuit addresses on the printhead.

Printhead having a plurality of print modes

A micro-fluid ejecting device includes a semiconductor substrate, a plurality of fluid ejection elements formed on the semiconductor substrate, and a plurality of nonvolatile programmable memory devices for storing information related to the operation of the micro-fluid ejecting device. The programmable memory devices, which are at least partially embedded in the semiconductor substrate, each include a source region and a drain region formed in the semiconductor substrate. The source and drain regions have a conductivity type which is opposite the conductivity type of the semiconductor substrate. An insulative layer is formed on the semiconductor substrate over the source region and drain region. A floating gate region is formed on the insulative layer and is spatially disposed between the source region and drain region. The floating gate region is electrically insulated from the source and drain regions by the insulative layer. Electrical contacts are connected to the source region and the drain region. The programmable memory devices collectively provide a high density of memory bits embedded on the substrate for storing information about the micro-fluid ejecting device.

Micro-fluid ejecting device having embedded memory devices

Test circuits on heater chips for testing a heater circuit having a heater element and a first power device. The test circuit can include a second power device, a test device configured to hold the first power device off and the second power device on for a selected heater circuit when the test device receives a signal to activate the test circuit, and a common test output to transmit a signal indicative of a state of the selected heater circuit. Methods for using the same are also provided.

Heater chip test circuit and methods for using the same

Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.

Methods and apparatuses for sensing temperature of multi-via heater chips

Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. Additionally, the first heater array and the second heater array are operable to receive heating responsive to the temperature of the region sensed by the temperature sensing element to regulate the temperature of the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor and the heating may occur via non-nucleating heating.

Methods and apparatuses for regulating the temperature of multi-via heater chips

A heater chip that includes a circuit element, and a bus that can be used to power the circuit element. The heater chip also includes a feedback circuit that is coupled to the power bus. Particularly, the feedback circuit can be configured to indicate if the bus is powered the circuit element.

Power sensing circuit

A semiconductor substrate for a micro-fluid ejecting device. The semiconductor substrate includes a plurality of fluid ejection devices disposed on the substrate. A plurality of driver transistors are disposed on the substrate for driving the plurality of fluid ejection devices. A programmable memory matrix containing embedded programmable memory devices is operatively connected to the micro-fluid ejecting device for collecting and storing information on the semiconductor substrate for operation of the micro-fluid ejecting device. The programmable memory matrix provides a high density of memory bits embedded on the substrate for storing information about the micro-fluid ejecting device.

Micro-fluid ejecting device having embedded memory device

An inkjet printhead heater chip includes a resistor layer, a dielectric layer on the resistor layer and a cavitation layer on the dielectric layer. A grounded-gate MOSFET electrically attaches to the cavitation layer to protect the dielectric layer from breakdown during an electrostatic discharge (ESD) event. Protection typically embodies the safe distribution of ESD current to ground during user printhead installation. Locations of the grounded-gate MOSFET(s) include terminal ends of one or more columns of ink ejecting elements formed by the resistor layer. Also, the MOSFET source electrically connects to the gate while the drain attaches to the cavitation layer. The drain attaches via first and second metallization lines, including attachment generally above the cavitation layer. The dielectric layer is diamond like carbon layer and is about 2000 angstroms thick. Inkjet printheads and printers are also disclosed.

Heater chip for inkjet printhead with electrostatic discharge protection

A method informs a user of an ink jet printer of the end of life of a consumable. The consumable supplies ink to a printhead having a plurality of ink ejection nozzles and an associated plurality of ink jetting actuators, each of the plurality of ink jetting actuators being addressable. The printhead includes a plurality of address lines for facilitating selection of one or more of the plurality of ink jetting actuators. The method includes the steps of defining a notice threshold that is associated with a corresponding amount of ink remaining in the consumable; providing control logic for selectively controlling the plurality of address lines; determining whether the amount of ink remaining in the consumable has reached the notice threshold; and upon reaching the notice threshold, reducing an image density of images formed by the printhead by selectively disabling at least one of the plurality of address lines.

Method of informing a user of end of life of a consumable for an ink jet printer

An inkjet printhead heater chip has an ink via asymmetrically arranged in a reciprocating direction of inkjet printhead movement. The ink via has two sides and a longitudinal extent substantially parallel to a print medium advance direction. A column of fluid firing elements exists exclusively along a single side of the two sides. The heater chip and ink via each have a centroid and neither resides coincidentally with one another. Preferably, the heater chip centroid resides externally to a boundary of the ink via. In other aspects, the column of fluid firing elements can be a sole column or plural and may be centered in the reciprocating direction. The ink via can be a sole via or plural. The heater chip can be rectangular and the ink vias can be closer to either the long or short ends thereof. Inkjet printers for housing the printheads are also disclosed.

Inkjet printhead heater chip with asymmetric ink vias

Some embodiments of the present invention provide an inkjet print head having a housing defining an ink reservoir, a nozzle portion including a nozzle plate defining an ink chamber in fluid communication with the ink reservoir, and forming a fluid flow path between the ink chamber and the ink reservoir, and a substrate coupled to the nozzle plate and having a surface substantially positioned over the nozzle plate. At least one heating element can be coupled to the substrate, and can be positioned adjacent the surface to heat a portion of the ink chamber. In some embodiments, the inkjet print head comprises a control circuit coupled to the at least one heating element for controlling the heating element, and a temperature sense element positioned substantially between the at least one heating element and the control circuit or in at least partially overlapping relationship with the heating element.

Inkjet print head

Growing community of inventors

Winchester, KY, United States of America

George Keith Parish