Lear Corporation

George Kaminski

Richard Joseph Hampo

Krzysztof S Klesyk

Nadir Sharaf

Dilip Daftuar

Venkat Rao Yalamanchili

An apparatus for monitoring a high voltage isolation in a vehicle. The apparatus comprising a power conversion device for receiving a high voltage on a power bus. The power conversion device is configured to control a first switch for enabling a first known resistance to receive the high voltage and to measure a first voltage between a first node and a ground in response to the first known resistance receiving the high voltage. The power conversion device is further configured to measure a second voltage between a second node and the ground in response to the first known resistance receiving the high voltage and to determine a first leakage resistance between the first node and the ground based on at least the first voltage and the second voltage. The first leakage resistance indicating whether the high voltage is isolated from the ground.

Method and apparatus for high voltage isolation monitor for a vehicle

An assembly includes a converter and a controller. The converter has a winding around a transformer core, first and second switches configured to alternately connect respective winding segments to an input power, and first and second resistors respectively connected in series with the switches. The controller is configured to compare voltages corresponding to currents through the resistors and terminate operation of the converter when a difference between the voltages exceeds a threshold indicative of transformer core flux walking.

Converter with transformer flux walk protection controller

A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.

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Livonia, MI, United States of America

George Kaminski