International Business Machines Corporation

George J Saxenmeyer, Jr

Jaynal Abedin Molla

George Frederick Walker

Voya Rista Markovich

Paul Alfred Lauro

Jerome J Cuomo

Sung Kwon Kang

John L Galvagni

David Noel Light

Douglas Oliver Powell

Anthony P Ingraham

John J Ritsko

David W Dranchak

Thomas P Gall

Perminder S Bindra

Jungihl Kim

Jack A Varcoe

Fletcher W Chapin

Ekkehard F Miersch

Raymond A Busacco

Richard Gerald Murphy

Michael A Gaynes

Kishor V Desai

Steven Paul Ostrander

Judith Marie Roldan

James R Petrozello

Chi Shih Chang

Thomas G Macek

Harold Kohn

Robert Babuka

Robert D Topa

Reinhold E Tomek

James R Webb

Ronald J Romanosky

Robert E Heath

Lewis K Schultz

Rod A Smith

Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a noble metal at a high current density.

Selectively filled adhesives for semiconductor chip interconnection and

A capacitor structure is described as having a plurality of dielectric materials located so that each dielectric material is in parallel between capacitor plates. The capacitor value of this structure is preset, therefore, for operation electrically at different specific temperatures. The description gives a specific stacked arrangement for the various dielectric materials in which this capacitor can be formed, as one example of that to which it is adaptable.

Method of manufacturing a decoupling capacitor structure

Decoupling capacitor structure

An electrical connector for interconnecting a pair of circuit members (e.g., a circuit board and module), which, in one embodiment, includes a housing, at least one flexible circuit within the housing and a spring means attached to the flexible circuit at two spaced locations for exerting force against the flexible circuit to cause the circuit to engage respective conductive pads on the circuit members when the circuit members are moved toward each other (e.g., compressed). The shape of the spring means conforms substantially to the portion of the flexible circuit between the locations of attachment. In another embodiment, a connector for interconnecting such circuit members includes a housing adapted for being located between both members and at least one elongated, compressible contact member in the housing and including conductive end portions for engaging the circuit members. The contact occupies a first, prestressed position before engagement and is adapted for moving to a second, compressed position during the engagement. The conductive end portions of the flexible circuit in the first embodiment and the contact member in the second embodiment preferably comprise a plurality of dendrites for providing enhanced connections.

High density connector

A method of forming conductive end portions on a flexible circuit member having a dielectric layer (e.g., polyimide) with at least one conductive element (e.g., copper) thereon. The method comprises the steps of forming (e.g., punching) an opening through both dielectric and conductive element, providing (e.g., additive plating) an electrically conducting layer on the opening's internal surface, providing (e.g., electroplating) a plurality of dendritic elements on the conducting layer's surface, and thereafter removing (e.g., punching) a portion of the dielectric and conductive element such that the formed dendritic elements (e.g., palladium) project from the flexible circuit's conductive ends.

Method of forming a conductive end portion on a flexible circuit member

An electrical assembly which includes a first circuit member (e.g., TCM) with at least one conductive pin projecting therefrom for being frictionally and electrically engaged by a flexible portion of circuit means of a second circuit member (e.g., PCB). An opening is provided within the PCB relative to the flexible portions such that these portions project at least partly across the opening and frictionally engage respective conductive portions of the pin when inserted within the opening. Each of these flexible portions in turn is part of a circuit layer which may be coupled to respective conductive planes or the like within the PCB, while the respective conductive portions of the pin may in turn be electrically coupled to various conductive layers within/upon the TCM.

Electrical assembly with flexible circuit

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Method of fabricating nendritic materials

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Separable electrical connection technology

An improved arrangement for cooling a module packaged semiconductor integrated circuit chip having heat generating microcircuits thereon is disclosed. Enhanced cooling over prior art techniques is achieved by utilizing an interfacial layer of liquid metal alloy coated metallic dendrites, which layer is sandwiched between two facing surfaces of the chip and a heat sink. Appropriate biasing means are also provided to urge the dendritic projections into piercing engagement with the liquid metal alloy layer, the biasing means being thermally coupled between the heat sink and the module container to thereby aid in forming unitary heat transfer path from the chip to the module container. The biasing means are adapted to provide sufficient force to cause the dendritic projections to engage and retain the liquid metal alloy layer and to non-destructively force the layer to fill all available space between the chip and the heat sink.

Restorable backbond for LSI chips using liquid metal coated dendrites

Growing community of inventors

Apalachin, NY, United States of America

George J Saxenmeyer, Jr