International Business Machines Corporation

Globalfoundries Inc.

George J Lawson

David Lewis Gardell

Marc Douglas Knox

Jeffrey Donald Gelorme

Luc Gilbert Guerin

Charles L Reynolds

Jiali Wu

Mark S Chace

Kathryn C Rivera

Van Thanh Truong

Normand Cote

Steve E Whitehead

Peter J Demko

Randall J Bertrand

Yvonne Morris

An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.

Temporary liquid thermal interface material for surface tension adhesion and thermal control

A liquid thermal interface (LTI) including a mixture of a linearly structured polymer doped with crosslinked networks and related method are presented. The LTI exhibits reduced liquid polymer macromolecule mobility, and thus increased surface tension. An embodiment of the method includes mixing a crosslinker with a linearly structured polymer to form a mixture, wherein the crosslinker includes a base agent including a vinyl-terminated or branched polydimethylsiloxane, and a curing agent including a hydrogen-terminated polydimethylsiloxane; and curing the mixture. The crosslinker functions as cages to block linear or branched linear macromolecules and prevents them from sliding into each other, thus increasing surface tension of the resulting LTI.

Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method

A heat sink for use in the burn-in of an I/C chip, which chip has a generally 'flat' surface. The heat sink has a 'flat' surface with micro-channels therein, positioned to open and close in and out of contact against the flat surface of an I/C chip being burned-in. At least one liquid opening communicates with said essentially flat surface on the heat sink to continuously apply liquid between the heat sink and the chip. A liquid inlet is provided to supply liquid to said at least one liquid opening. A recovery channel is positioned to recover liquid from between the heat sink and the chip, and an exhaust member is provided to carry liquid from said recovery channel to the exterior of the heat sink. The invention also includes a method of burning-in a chip.

Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application

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Barre, VT, United States of America

George J Lawson