Intel Corporation

George Hoekstra

Jerry A Kreifels

Steven E Wells

Virgil N Kynett

Mark D Winston

Alan E Baker

A semiconductor flash EPROM/EEPROM device which includes a command port controller for receiving command instructions from a data bus coupled to the memory device. Instruction words to a command port controller operates to instruct the device to perform read, erase, program, or verify functions and the command port controller generates necessary control signals to cause the memory to function appropriately. By utilizing the command port controller the memory device can be erased and programmed while the device is in the circuit and permits pin compatibility with the prior art EPROM and EEPROMs.

Processor controlled command port architecture for flash memory

A semiconductor flash EPROM/EEPROM device which includes a command port for receiving instruction on a data line and providing control signals to a memory for providing program and erase functions, a method to program and erase the memory. A program sequence is comprised of setting up a program command during a first write cycle, preforming a second write cycle to load address to address register and data to to a data register, programming during a program cycle and writing a program verify command during a third write cycle to verify the programmed data during a read cycle. An erase sequence is comprised of writing a setup erase command during a first write cycle, an erase command during a second write cycle providing the erasure during an erase cycle, writing the erase verify command during a third write cycle which also addresses the address of the memory and providing erase verification during a read cycle. Both the erase and program cycles provide for measured incremental erasing and programming.

Program/erase selection for flash memory

A circuit and method for verifying leakage in a flash EPROM/EEPROM memory cell which is fabricated on a silicon substrate having floating gate. A word line coupled to the control gate of the memory cell is typically at ground potential, but during a test mode a positive voltage is placed on the control gate and leakage current at the drain is measured. A good cell will typically have zero or negligible drain leakage current, however, a cell which is susceptible to being overerased will exhibit appreciable leakage current. A circuit is implemented on the chip with the memory for switching a positive voltage onto the word line during the test mode.

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Santa Clara, CA, United States of America

George Hoekstra