Ferro Corporation

George E Sakoske

Srinivasan Sridharan

Ponnusamy Palanisamy

John J Maloney

Enos Ayres Axtell, Iii

Joseph E Sarver

Terry J Brown

Martin Baumann

Jackie D Davis

Gregory R Prinzbach

Dietrich Speer

Terry J Detrie

Cody J Gleason

Chandrashekhar Sadanand Khadilkar

Stanley Wang

David M Stotka

Sandeep K Singh

Stephen Rozwood

David Klimas

Dennis R Gilmore

Robert P Blonski

Yie-Shein Her

David C Kapp

Andreas Schulz

Thirumalai Duraisamy

Orville Washington Brown

James D Walker

Juergen Hanich

David L Widlewski

Kenneth R Ackerman

Cindy Pankiewicz

Bradford Smith

Lothar Heck

William G Picard

Phil Maitland

John M Bauer

Ellen Schwartz Tormey

Walter J Symes, Jr

Yi Yang

Hans-Peter Letschert

Daniel Russell Swiler

Mohammed H Megherhi

Stephan Ludwig

Andrew M Rohn, Jr

Frank Walter

Kimberly Ann Stewart

George E Graddy, Jr

Sean T Weir

Gary L Nuccetelli

Michel Claus

Thomas Joseph Coffey

Bertram Gardner

Umesh Kumar

Nicholas M Karpa

Benoit Darbouret

Michael J Hensel

David J Matalka

Jean-Luc Grapton

Kameron Gale

Elena D Milliken

Ian Dudas

Peter Marley

Ellen S Tomey

Vineet Dua

Osamu Ishii

Chih Cheng Wang

Jeffrey Grover

Chao Ma

Herve Laronze

Walter Frank

Yvan Garnier

James E Henry

David L McGowan

Enos A Axtell

Bradford J Smith

Enos A Iii Axtell

Sandeep Singh

David Widlewski

Walter Symes

Yie-Shen Her

David A Klimas

A marking composition for forming marks or indicia on a substrate is provided for laser marking applications. The composition includes a glass frit, a carrier, and absorber particles. The glass frit includes alkali metal oxides, glass forming oxides, and one or more transition metal oxides. The glass frit is devoid of at least one of bismuth and zinc.

Colored glass frits and related methods for laser marking applications

A curable glass coating composition including 5-70 wt % aliphatic polycarbonate diol, 5-60 wt % crosslinker, 1-20 wt % extender, 4-20 wt % fatty alcohol, and 2-30 wt % crystalline or amorphous powder filler material, and optionally 2-20 wt % aliphatic polyester polyol and 2-20 wt % cycloaliphatic epoxy. The coating composition can be applied to a glass substrate and cured to form a decorative cured polyurethane coating layer on the substrate that has improved caustic and UV resistance.

Polycarbonate diol coating composition for caustic and UV resistance

A phosphor in glass (PiG) cover is provided to modulate the color emitted from an LED chip. The PiG cover includes an active layer including glass and phosphor, and a secondary layer including glass and free of phosphor. The active layer is stacked on the secondary layer to form the PiG cover. Alternately the PiG includes an active layer sandwiched between two secondary layers. Two or more active layers can be stacked to each other or disposed side-by-side. An LED chip is arranged under the PiG cover to form an LED package.

Layered phosphor in glass

A sintered machinable glass-ceramic is provided. The machinable glass-ceramic is formed by mixing phyllosilicate material having a sheet structure, with a glass fit and firing the mixture at relatively low temperatures to sinter the phyllosilicate, while maintaining the sheet-like morphology of the phyllosilicate and its associated cleaving properties. The sintered machinable glass-ceramic can be machined with conventional metal working tools and includes the electrical properties of the phyllosilicate. Producing the sintered machinable glass-ceramic does not require the relatively high-temperature bulk nucleation and crystallization needed to form sheet phyllosilicate phases in situ.

Sintering aid for glasses for machinable phyllosilicate based structures

Modified copper chromite spinel pigments exhibit lower coefficients of thermal expansion than unmodified structures. Three methods exist to modify the pigments: (1) the incorporation of secondary modifiers into the pigment core composition, (2) control of the pigment firing profile, including both the temperature and the soak time, and (3) control of the pigment core composition.

Modified black spinel pigments for glass and ceramic enamel applications

A compounded polymer material that can be laser marked is provided. The compounded polymer material includes an enhancer of nitrides, carbides, silicides, or combinations thereof. Upon forming the compounded polymer material into an article and exposing it to laser radiation, the irradiated portion of the compounded polymer material absorbs the laser radiation, increases in temperature, and forms a mark in the article. A lightness value difference (&#x394;L) between the mark and the non-irradiated portion of the article has an absolute value of at least 5, and the lightness value difference between the mark and the non-irradiated portion is greater than if the polymer material did not include the enhancer.

Carbide, nitride and silicide enhancers for laser absorption

The present invention describes a new method for creating hybrid edge seals using metal, alloy, powder coated metal and other conductive surfaces in between two substrates. The methods utilize various materials, seal designs, and geometries of hybrid seals based on polymeric powder coatings and glass powder coatings.

High performance organic, inorganic or hybrid seals

A universal or all-purpose laser marking composition for forming satisfactorily dark laser marks on a wide variety of substrates is provided. The marking composition comprises an enhancer of nitrides, carbides, silicides, and combinations thereof. The enhancer may be selected one or more of ferromanganese, ferrosilicon, FeSiwhere X can range from about 0.005 to 0.995, FeSi, MgFeSi, SiC, CaSi, (Co)Mo, MoSi, TiSi, ZrSi, WSi, MnSi, YSi, CuSi, NiSi, FeC, FeCand FeC, MoC, MoC, MoC, YC, WC, AlC, MgC, MgC, CaC, LaC, TaC, FeN, FeN, FeN, FeN, FeN, MoN, MoN, WN, WN, WN, and combinations thereof and combinations thereof. Upon disposing the marking composition on a substrate and exposing the marking composition to laser radiation, the marking composition absorbs the laser radiation, increases in temperature, chemically bonds with the substrate, and when formed on each of a metal, glass, ceramic, stone, and plastic substrates, the mark has a negative &#x394;L dark contrast value of at least &#x2212;1 compared to a mark formed by the marking composition without the enhancer.

A method of modifying glass frit involves treating the frit with a grain-boundary-healing compound. The method increases transmission and clarity, and reduces haze of a fired enamel coating made from such modified glass frit as compared to a coating not made from such modified glass frit. The grain-boundary-healing compound influences the chemistry at the grain boundaries to prevent haze. The compound burns out to yield a fluxing material that dissolves alkaline carbonates or bicarbonates on the surface of the glass frit. The dissolved species are incorporated into the enamel coating, thereby promoting the fusion of the glass frit and reducing the amount of haze in the enamel coating. The additives also function to prevent the formation of seed crystals on the surface of the glass frit that may inhibit the fusion of the glass frit.

Grain boundary healing glasses and their use in transparent enamels, transparent colored enamels and opaque enamels

A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material. The dielectric material can be fired below 950&#xb0; C. or below 1100&#xb0; C., has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000 at 10-30 GHz. The dielectric material includes, before firing a solids portion including 10-95 wt % or 10-99 wt % silica powder and 5-90 wt % or 1-90 wt % glass component. The glass component includes 50-90 mole % SiO, 5-35 mole % or 0.1-35 mole % BO, 0.1-10 mole % or 0.1-25 mole % AlO, 0.1-10 mole % KO, 0.1-10 mole % NaO, 0.1-20 mole % LiO, 0.1-30 mole % F. The total amount of LiO+NaO+KO is 0.1-30 mole % of the glass component. The silica powder can be amorphous or crystalline.

Low K dielectric compositions for high frequency applications

A passivation glass coating composition is provided for forming a fired passivation glass layer on a semiconductor substrate having p-n junction. The passivation glass coating composition includes a glass component that is lead free, cadmium free, alkali metal oxides free, and colored transition metal oxides (i.e. metal oxides of V, Fe, Co, Ni, Cr, Cu, Mn) free. The glass component includes bismuth based glasses, and provides a firing temperature range of 500&#xb0; C. to 900&#xb0; C., and controlled devitrification. Once fired to a semiconductor device, the fired passivation glass layer provides exceptional device performance including no cracking of the fired passivation glass layer, excellent thermal expansion matching to silicon, good chemical resistance to acid and base, and improved device performance.

Passivation glasses for semiconductor devices

Methods of making multilayer glass structure are described. The method involves providing first and second glass sheets, and a first enamel composition layer and at least one separation layer between the first and second glass sheets, and firing the glass sheets to sinter the first enamel composition to the first glass sheet. The separation layer is a black pigment separation layer, a refractory material separation layer, or an oxidizer separation layer. The separation layer can improve separation of the first and second glass sheets after the firing.

Method of making multilayer glass structure

Silver pastes including two powders having different physical properties and silver flakes together with glass frits and pigments impart improved thermal stress characteristics to substrates upon firing.

Conductive paste with improved performance in glass strength

A multi-layer glass enamel is disclosed. The various layers of the enamel are included to provide certain performance characteristics to the enamel. The components of each layer can be individually adjusted to tailor the performance characteristics influenced by that layer without changing the influence of the remaining layers.

Method of forming durable glass enamel

A method of sealing at least two inorganic substrates together using an induction energy source comprising applying to at least one of the substrates a paste composition including a glass frit, and an induction coupling additive, bringing at least a second substrate into contact with the paste composition, and subjecting the substrates and paste to induction heating, thereby forming a hermetic seal between the two inorganic substrates.

Induction sealing of inorganic substrates

Growing community of inventors

Independence, OH, United States of America

George E Sakoske