Novus Corporation

Other

George E Niemirowski

Adam F Niemirowski

John M Harrell

P V Patel

The described embodiments of the present invention provide a wafer boat that is manufactured using polysilicon. A further embodiment of the invention is a mechanical boat manufacturing technique which avoids the use of welding and other forms of bonding. Another embodiment of the present invention is a polysilicon wafer boat that is formed with a plurality of spaced parallel rods having slots for supporting a series of semi-conductor wafers in a generally edgewise, spaced, parallel position. The rods are mechanically held in place at each end by a plate and capturing mechanism. In yet another embodiment of the invention, polysilicon rods are machined to a tight tolerance with openings in end pieces of the boat. The rods are held firmly in place by polysilicon wedges. This makes for a very rigid structure. If so desired, the boat can then be coated with a layer of polysilicon in a furnace to better lock the parts together.

Semiconductor wafer carrier having the same composition as the wafers

An apparatus for preventing the cross contamination of heating element within horizontal furnaces is disclosed. A rotating spindle may connect to either or both of the lifting arm of a triaxial loader or the transfer plate of a loading station. A pair of spindles are able to lift a single wafer boat. Each spindle includes a plurality of active positions with one active position associated with each heating element of the horizontal furnace. A control processor monitors the position of the spindle and rotates the spindle to the active position associated with a heating element when a loading or unloading process is initiated for that heating element.

Transfer system for use with a horizontal furnace

A device for holding a semiconductor wafer cassette to enable manipulation of the cassette during semiconductor manufacturing processes is disclosed. The device includes a shielding plate for enclosing an open face of a semiconductor wafer cassette. A pair of gripping arms are pivotally connected to edges of the shielding plate for grasping the edges of a semiconductor wafer cassette in response to actuation by a trigger and linkage contained within a handle of the device. The trigger actuates the gripping plates between an opened and closed position. When the cassette is gripped, it may be manipulated in the horizontal and vertical directions by an operator using the handle of the device.

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South Lane, TX, United States of America

George E Niemirowski