Hewlett Packard Enterprise Development LP

Hewlett-Packard Development Company, L.p.

Compaq Computer Corporation, Inc.

Other

Hewlett-Packard Company

George D Megason

Kevin B Leigh

John Norton

Brett D Roscoe

Christian H Post

Joseph R Allen

John Robert Grady

David W Sherrod

Robert A Lester

Siamak Tavallaei

John Edward Larson

John MacLaren

Paul A Santeler

Jeffery L Galloway

Eric Rose

Anisha Anand

Tim W Majni

Arlen Lee Roesner

Thomas T Hardt

Paul Kessler Rosenberg

Wade David Vinson

Everett R Salinas

Christopher C Wanner

Daniel T Thompson

David M Paquin

Chong Sin Tan

Arthur G Volkmann

Henry C Coles

Carl E Davis

Dit Charoen

John P Franz

Kelly Kennedy Smith

Troy Anthony Della Fiora

William J Walker

Alan B Doerr

Sunil Ganta

Kurt A Manweiler

Guodong Zhang

Rachid Kadri

David W Deis

Eugene E Freeman

Michael E Taylor

David S Blocker

Wanda L Bloomfield

Example implementations relate to an electronic device packaged on a wing board. For example, an implementation includes a base board having a planar signal interface to couple parallelly to a signal interface segment of a system board. The example implementation also includes a plurality of wing boards to scale in a direction perpendicular to a plane of the base board. An electronic device is packaged on each of the wing boards. A flexible circuit flexibly links at least one of the wing boards to the base board and has a signal path to communicatively couple the planar signal interface and an electronic device packaged the wing board.

Electronic devices packaged on wing boards

One example of a system includes a system board including first contacts, a cage attached to the system board over the first contacts, and a removable transceiver module including second contacts. The transceiver module is installable in the cage in response to a lateral movement of the transceiver module with respect to the cage to align the second contacts with the first contacts and a vertical movement of the transceiver module with respect to the cage to electrically connect the first contacts to the second contacts.

Transceiver module

An example frame shuffle is communicatively coupled to a midplane of a frame. The frame shuffle includes a first group of optical connectors. Each of which are communicatively coupled to a resource device via the midplane. The frame shuffle also includes a second group of optical connectors, each of which communicatively couples with a frame shuffle of an adjacent frame. The frame shuffle also includes a routing device to optically interconnect the resource devices and another group of resource devices of the adjacent frame. The frame shuffle also includes a frame shuffle fan to provide fresh air through the frame shuffle and direct exhaust air through the midplane.

Interconnected modular server and cooling means

An example electro-optical connector may comprise an optical ferrule to optically engage with a complementary optical ferrule on a complementary electro-optical connector, a first conductive guide post disposed adjacent to the optical ferrule to electrically engage with a first guide pocket of the complementary electro-optical connector, and a second conductive guide post disposed on an opposite side of the optical ferrule from the first conductive guide post and to electrically engage with a second guide pocket of the complementary electro-optical connector. The first and second conductive guide posts may align the optical ferrule for engagement with the complementary optical ferrule when the guide posts are engaged with the respective guide pockets, and the first and second conductive guide posts may conduct an electrical signal or electrical power from the electro-optical connector to the complementary electro-optical connector.

Electro-optical connectors

One example of a system includes a blade enclosure and a midplane within the blade enclosure. The midplane supports a first sleeve connector and a second sleeve connector, where each of the first and second sleeve connectors have a first side and a second side. A server blade installed in the blade enclosure includes an air duct coupled to the first side of the first sleeve connector. A cooling module including an air manifold is coupled to the second side of the first sleeve connector to deliver cool air to the air duct of the server blade.

Cooling via a sleeve connector

An example connector mount may comprise a bracket to receive a connector. The example connector mount may further comprise a first and second guide spring disposed on the bracket. Each of the first and second guide springs may be to engage with the connector and each provide resistance to movement of the connector in a horizontal, and a vertical direction.

Connector mounts

A base layer architecture (BLA) infrastructure device comprises a power base layer (PBL) to supply power to a cartridge, a cold thermal base layer (cold TBL) to cool the cartridge, a hot thermal base layer (hot TBL) to remove heat from the cartridge, an optical base layer (OBL) to transmit an optical signal to the cartridge and a radio frequency base layer (RBL) to transmit a radio frequency signal to the cartridge. Each base layer comprises a rack interface to couple the base layer to a rack and a number of cartridge interfaces to couple the base layers to the cartridge. A BLA infrastructure system comprises a BLA infrastructure device comprising a number of base layers. The number of base layers are removably coupled to a rack and a system management device to manage the number of base layers.

Base layer architecture infrastructure device

An example device in accordance with an aspect of the present disclosure includes a first shield to provide thermal isolation between a first component and a heatsink of a second component, and to provide a cooling channel that is thermally isolated from the heatsink to receive an airflow for the first component. A second shield is to provide thermal isolation between the first shield and the heatsink, and to provide a thermal barrier region between the first shield and the second shield.

First and second shields for thermal isolation

Examples herein disclose a plenum. The plenum includes an enclosed structure to deliver cool air to multiple enclosures within a rack and multiple cables to route to the multiple enclosures within the rack. The plenum further includes a connector to attach the multiple cables in the plenum to one of the multiple enclosures.

Plenum to deliver cool air and route multiple cables

In one example, a system for a cage assembly for an optical module includes a receptacle coupled to an interposer card, a number of rails coupled to the interposer card to align an optical module with the receptacle, and a mezzanine card coupled to the interposer card, wherein the optical module is utilized via the mezzanine card.

Cage assembly for optical modules

Examples relate to devices comprising a stationary pivot plenum and a rocker-arm assembly pivotally coupled to the stationary pivot plenum and wherein the rocker-arm assembly comprises an inner conduit having at least one connector bay in which a connector of a cable assembly is removably coupled to the connector bay. In such examples the inner conduit of the rocker-arm assembly is accessible from the outside of the rocker-arm assembly to independently engage/disengage the removable cable assembly to/from the at least one connector bay.

Rocker-arm assemblies with connectable cable

An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board.

Semiconductor assembly

In one example, a system for a module board coupling includes a module bracket coupled to a plate, a module board coupled to the plate, a number of frame pins coupled to the module frame to slide under the plate when a back spring coupled to the module bracket is depressed, wherein the module board is engaged with a socket when the number of frame pins slide under the plate.

Module board coupling

A system is provided for computer networking. The system includes a first frame installed in a rack. The first frame includes a first frame shuffle that interconnects resource modules within the first frame and a first rocker-arm plenum that interconnects resource modules of the first frame with resource modules of other frames of the rack through a high-bandwidth fabric. The system also includes a second frame installed in the rack. The second frame includes a second frame shuffle that interconnects resource modules within the second frame and a second rocker-arm plenum communicatively coupled to the first rocker-arm plenum, wherein the second rocker-arm plenum interconnects resource modules of the second frame with resource modules of other frames of the rack through the high-bandwidth fabric. The system further includes a frame bridge. The frame bridge includes a first bracket slidably connected to a second bracket. The second bracket contains a data connector including a first terminal and a second terminal such that the data connector is contained within the frame bridge, and wherein the first terminal is coupled to the first frame shuffle and the second terminal is coupled to the second frame shuffle such that the first frame shuffle is communicatively coupled to the second frame shuffle.

Computer networking interconnectors

One example of a system includes a receptacle including a plurality of bays. Each bay of the receptacle supports 1-lane of network communications. The receptacle is to connect to a multi-lane cable to provide a multi-lane port or connect to a plurality of 1-lane cables to provide a plurality of 1-lane ports.

Receptacle for connecting a multi-lane or one-lane cable

Growing community of inventors

Spring, TX, United States of America

George D Megason