Motorola Corporation

Belkin Components

George C Chen

William Patrick Conley

Rodger Dale Thomason

Stephen Lester Bellow, Jr

Lawrence G Kurland

Alexander James Elliott

Prosanto K Mukerji

Kent L Kime

Lawrence Scott Klingbeil

Pablo Rodriguez

Keith W Bailey

William L Fragale

Gary R Lorenzen

Timothy E Meko

A security device secures an apparatus having a wall () with a slot (). The security device includes first and second shafts. The shafts have arms () rotatable about their respective axis into and out of their respective unlocked positions. Each of the axes of the arms are different from each other. The shafts also have tangs () extending from the arms.

Security device, method of manufacturing the same, and method of operating the same

A security device secures an apparatus having a wall ( ) with a slot ( ). The security device includes first and second shafts. The shafts have arms ( ) rotatable about their respective axis into and out of their respective unlocked positions. Each of the axes of the arms are different from each other. The shafts also have tangs ( ) extending from the arms.

An electronic component includes a semiconductor substrate (101, 301, 401), an electrically conductive layer (102, 103, 302, 303, 402, 403) supported by the semiconductor substrate (101, 301, 401), and a lead (110, 120, 210, 310, 410, 420) having an electrical coupling portion (112, 122, 212, 312, 412, 422) coupled to and supported by the electrically conductive layer (102, 103, 302, 303, 402, 403) wherein the electrical coupling portion (112, 122, 212, 312, 412, 422) has at least one notch (115, 215, 315) adjacent to the electrically conductive layer (102, 103, 302, 303, 402, 403).

Electronic component and method of manufacture

A method of manufacturing a semiconductor device includes providing an apparatus (210, 510) having tabs (212, 214, 412, 414) for holding and separating semiconductor substrates wherein a first tab (212, 412) is different from a second tab (214, 414), using the first tab (212, 412) to support a semiconductor substrate (224) wherein the second tab (214, 414) does not support the semiconductor substrate (224), and exposing the semiconductor substrate (224) to a chemical to move the semiconductor substrate (224) towards the second tab (214, 414) without removing the semiconductor substrate (224) from the apparatus (210, 510).

Method of manufacturing a semiconductor device and apparatus therefor

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Chandler, AZ, United States of America

George C Chen