Motorola Corporation

Other

George Amos Carson

James H Knapp

Cynthia M Melton

Francis J Carney, Jr

Keith E Nelson

Grace M O'Malley

Harry Fuerhaupter

Phillip C Celaya

Donald H Klosterman

Frank Tim Jones

Andrew Frederick Skipor

Karl W Wyatt

Iwona Turlik

Lillian Charell Thompson

Sean Xin Wu

Wen Xu Zhou

Steven C Machuga

Michelle J Morrell

Brian J Bullock

Danniel Roman Gamota

Dion D Xenos

A steam cooker with a first pot and a second pot is provided. The second pot may fit within the first pot and may be suspended above the bottom of the first pot. The bottom of the first pot may be filled with water. Food may be placed within the second pot. A lid may cover the first pot, sealing the water and the second pot within. The first pot may be heated by a fire or stove. The steam from the heated water may sufficiently cook the food. Further, condensation may be collected and water may drip into the second pot. The water is purified due to the boiling process.

Steam cooker

A system and method for operating a tire temperature warning system with an optional cooling solution is disclosed.

Tire temperature emergency warning heat indicator/transmitter with cooling solution

A rain gutter cleaning system of the invention comprises a generally planar panel, or two generally planar panels, movably secured to the bottom of the gutter. The rain gutter cleaning system includes a hinge securing one end of the generally planar panel to the gutter. One generally planar panel is normally disposed in a first position. In this first position, the generally planar panel is adjacent to, and generally parallel to, the gutter. The generally planar panel may be moved to a second position. In this second position, the generally planar panel is pivotally spaced apart from the gutter.

System for dislodging and removing debris in gutters

A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24). The polymeric precursor (36) is then cured to form a polymeric encapsulant (38) that encapsulates the integrated circuit die (12).

Microelectronic package including a polymer encapsulated die

A microelectronic assembly (10) includes a polymeric card (12) that includes a substantially planar major surface (18). An integrated circuit component (14) is embedded in the polymeric card (12) and has a first contact (20) and a second contact (22). An antenna element (16) is formed of a singular metallic strip and includes a first terminal (26) electrically connected to the first contact (20), a second terminal (28) electrically connected to the second contact (22), and a loop (30) intermediate the first terminal (26) and the second terminal (28). The first terminal (26) includes a first outer surface (32) and the second terminal (28) includes a second outer surface (34). The first outer surface (32) and the second outer surface (34) are exposed at the major surface (18) and are coextensive therewith. The loop (30) is embedded within the polymeric card (12) and spaced apart from the major surface (18).

Microelectronic assembly including an antenna element embedded within a

A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).

Microelectronic assembly including polymeric reinforcement on an

Microelectronic package including a polymer encapsulated die, and method

A microelectronic assembly (10) includes an integrated circuit component (14) attached to a polymeric substrate (12) by a plurality of unencapsulated solder bump interconnections (16). A collar (18) is affixed to the polymeric substrate (12) about the integrated circuit component (14) and is formed of an inorganic material having a coefficient of thermal expansion less than that of the substrate (12). The collar (18) constrains thermal expansion of the polymeric substrate (12) in the die attach region (22), thereby lessening any deleterious effects caused by a mismatch in the thermal expansion of the polymeric substrate (12) and the integrated circuit component (14).

Microelectronic assembly with collar surrounding integrated circuit

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Elk Grove Village, IL, United States of America

George Amos Carson