Union Carbide Corporation

Elkem Metals Company

Amoco Corporation

George A Salensky

Kuldip S Chopra

Nicholas J Pappas

Thomas S Thoman

Stephen B Rimsa

George E Ealer

Sidney E Berger

John S Fry

Ronald A Martineau

Stanley H Richardson

Bernard Mohr

Described herein is a composite structure comprising a dielectric substrate surface with an electrically conductive layer or pathway thereon. The pathway comprises a thermoset resin and sufficient electrically conductive metal, in the configuration of an electric circuit element, to provide desired properties and direct solderability. Direct solderability is achieved without plating the electric circuit element. It has a low surface resistivity, preferably less than 10 m ohm per square. Also described are conductive, thixotropic inks for printed circuit devices which include silver powder and silver flake in its composition. A thixotropic adhesive for bonding the electric circuit element to the dielectric substrate surface is also taught. A method for making the composite structure is further disclosed.

Method of making solderable printed circuits formed without plating

This invention relates to an adhesion promoting composition and method for its use for promoting adhesion of printed circuits on thermoplastic substrates. The composition includes isopropanol with either methylene chloride or resorcinol. An added ingredient includes polycyclohexanone. The preferred substrate is polyarylsulfone.

Adhesion promoter for thermoplastic substrates and method employing same

This invention relates to a solder mask composition for thermoplastic substrates. The solder mask has critical components which include a polyhydroxyether and melamine formaldehyde. Other components include a solvent, filler and flow control agent. Optional ingredients include a colorant, epoxy resin and acid to promote the reaction of the composition. A surfactant can also be included. The solder mask provides the necessary flexibility and adhesion required for thermoplastic circuit boards. The mask can be applied directly to a circuit board or to a transfer medium for subsequent covering of a substrate. It relates to an article which can be a circuit board. It also relates to a process for making such composites which includes processing the solder mask.

Process for using a composition for a solder mask

Phenoxy resins are acid-grafted by reaction of secondary hydroxyls with monoanhydrides of di- or polycarboxylic acids. The grafted resins have improved adhesion to smooth surfaces, can be readily emulsified, and are also useful in coatings for magnetic recording media.

Magnetic coating compositions from carboxylic acid-grafted phenoxy resins

Carboxylic acid-grafted phenoxy resins

Divalent metal complexes of novolacs act as modifiers for alkyds, drying oils, epoxy esters, epoxy resins and thermoplastic polyhydroxyethers. Lamellar, non-lamellar and spherical pigments improve corrosion and salt spray resistance of coatings made from these compositions.

Metal-containing phenolic coating compositions

Zinc rich, solvent resistant and corrosion resistant coatings are prepared by blending zinc pigment, a thermoplastic polyhydroxyether and an organic dianhydride or polyanhydride.

Single package solvent resistant zinc rich thermoplastic

Manganomanganic oxide fume or a material containing manganomanganic oxide fume as its principle ingredient is used as a color pigment in the production of thermoplastic articles and particularly thermoplastic films.

Color pigment for use in the production of thermoplastic articles

Zinc rich coatings with improved corrosion resistance are provided by a composition consisting essentially of zinc pigment, thermoplastic polyhydroxyether or thermosetting epoxy resin, an organosilane or its hydrolyzates and optionally aluminum trihydrate, and one or more dispersing agents.

Zinc rich coatings

Corrosion inhibitive pigments are prepared by sintering manganomanganic oxide with stoichiometric amounts of oxides of calcium, zinc, barium, magnesium, or strotium or a mixture of calcium and boric acid at a temperature of about 500.degree. to about 800.degree. C.

Corrosion inhibitive pigments

Manganomanganic oxide or a material containing manganomanganic oxide as its principle ingredient is used as a colorant with good staining and retention properties in compositions of water emulsion based coatings.

Color retention pigment for paint compositions using latex vehicles

Manganomanganic oxide fume or a material containing manganomanganic oxide fume as its principle ingredient is used as a color pigment in the formulation of solvent-base paints.

Improved color pigment for solvent-base paint formulations

Paint formulations employing zinc and manganomanganic oxide fume or a material containing predominantly manganomanganic oxide fume as a corrosion inhibitive system.

Growing community of inventors

Whitehouse Station, NJ, United States of America

George A Salensky