Ems-patent Ag

Ems Inventa Ag

Norma Germany Gmbh

Ems-chemie Ag

Georg Stöppelmann

Botho Hoffmann

Manfred Hewel

Etienne Aepli

Janos Kertesz

Nikolai Lamberts

Hans-Gerhard Fritz

Ralf Hala

Thomas Wiedemann

Philipp Harder

Ulrich Presenz

Helmut Thullen

Mark Pfleghar

Oliver Thomas

Heinz Caviezel

Alex Stolarz

Sabine Bertram

Jean-Jacques Linster

Ronny Ebling

Fan Jin

Gabriel Garcia

Martin Sütterlin

Michael Hoffmann

André Sturzel

Dietmar Etzel

Doris Abt

Andreas Janisch

Thullen Helmut

Albert Flepp

A multi-layer composite in the form of a hollow body enclosing an interior space () is proposed, consisting of three or four layers: an inner layer () adjoining the interior space (), a middle layer () adjoining the latter and an outer layer () adjoining the middle layer () and closing the multi-layer composite () to the outside. If necessary, there is a further innermost layer () which directly adjoins the said inner layer () and is equipped with a conductive finish. The inner layer () is based on polyamide 6, the middle layer () is based on EVOH, and the outer layer () is based on a mixture of (A) polyamide 6 and (B) at least one other polyamide selected from the following group: polyamide 612, polyamide 614, polyamide 616 and polyamide 618.

Fuel line, method for producing same, and uses thereof

The present invention relates to polyamide molding compounds which contain the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one amorphous or microcrystalline specific polyamide; (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 616, PA 516, PA 1016 and mixtures thereof; and (C) 0 to 16% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The present invention also relates to molded articles made of these polyamide molding compounds and the use thereof.

Polyamide molding compound

The invention relates to a polyamide moulding compound consisting of an amorphous, microcrystalline or partially crystalline polyamide or mixtures hereof, at least one impact modifier, hollow glass balls and also further additives. The invention likewise relates to moulded articles produced from this polyamide moulding compound.

Polyamide moulding compound and moulded articles producible therefrom

A plastics line () is described with at least one layer () consisting of the following components:

Flexible plastic line, method for the production thereof, and uses of same

Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Polyamide moulding compounds with low relative permittivity

The present invention relates to polyketone molding compounds based on partially crystalline, aliphatic polyketones. In particular, it relates to halogen-free, flameproof molding compounds based on aliphatic polyketones which preferably comprise salts of phosphinic acids as flame retardant. The molding compounds fulfill the fire protection classification V0 according to UL94 and display good mechanical properties. These molding compounds are suitable for the production of in particular thin-walled molded articles for the electrical and electronics industry, such as for example housings, housing components or connectors.

Flameproof, aliphatic polyketone materials, moulded articles produced therefrom and also method for the production thereof

Moulding compound, comprising 30 to 80% by weight of a polyamide as a thermoplastic matrix and of a cross-linked, disperse elastomer phase which is bonded to the thermoplastic matrix and contains 10 to 69% by weight of an ethylene copolymer and also 1 to 10% by weight of a compatibility agent, selected from the compounds obtained by means of grafting of &#x3b1;, &#x3b2;, ethylene-unsaturated mono- and/or dicarboxylic acids or derivatives thereof on an ethylene-copolymer-polymer backbone, respectively relative to the moulding compound.

Moulding compound and method for production thereof

The invention concerns anti-static, peroxide-stable molding compounds on the basis of polyamides and/or polyesters, whereby the molding compounds are modified with very pure conductive carbon black with a low specific surface area. These anti-static molding compounds can be used for the production of injection-molded or extruded parts and the production of sheets or multi-layer hoses and tubes.

Anti-static and peroxide-stable molding compounds

Growing community of inventors

Bonaduz, Switzerland

Georg Stöppelmann