Schott Glas

Georg Geissler

Bernd Hoetzel

Dirk Hauer

Heinrich Ostendarp

Christoph Hermanns

Juergen Stein

Andrew Blunck

Ralf Steinfartz

Thomas Lüttgens

The cutting of the flat glass plate () into rectangular plates with a predetermined edge length is performed by forming initial cracks at the beginning of cutting lines on the glass plate and moving a laser beam along the cutting lines followed by a cooling spot to induce a thermo-mechanical stress alone the cutting lines. First the glass plate () is cut apart into partial plates () along first parallel cutting lines spaced according to the predetermined edge length. Then the cut apart glass plate is rotated by 90&#xb0; and the partial plates () are moved apart from each other. Subsequently the partial plates that have been moved apart are cut apart alone several parallel second cuts () perpendicular to the first cuts. This method facilitates exact placement of the initial cracks.

Method and device for cutting a flat glass plate into a number of rectangular plates

The method and apparatus for cutting through flat workpieces made of glass can cut through workpieces with greater thickness, e.g. glass panes with a thickness greater than 0.2 mm, than possible up to now with a comparable known method, without micro-fractures, glass fragments or splitter. In the method of the invention a heat radiation spot symmetric to the cutting line is produced on the workpiece. This heat radiation spot has edge portions with elevated radiation intensity and is moved along the cutting line on the workpiece and the heated section of the cutting line is subsequently cooled. A scanner motion produces the heat radiation spot so that edge portions of elevated radiation intensity coincide with a V- or U-shaped curve, which is open at the leading end of the heat radiation spot. The peak portion of the V- or U-shaped curve on the cutting line is at a temperature maximum that is under the melting point of the workpiece material. A controller of the scanning motion controls the scanner in circular cutting and freeform cutting so that a curved V- or U-shaped intensity distribution which fits the curved cutting path arises.

Method and apparatus for cutting through a flat workpiece made of

The method and apparatus for cutting through flat workpieces made of glass can cut through workpieces with greater thickness, e.g. glass panes with a thickness greater than 0.2 mm, than possible up to now with a comparable known method, without micro-fractures, glass fragments or splitter. In the method of the invention a heat radiation spot symmetric to the cutting line is produced on the workpiece. This heat radiation spot has edge portions with elevated radiation intensity and is moved along the cutting line and/or the workpiece and the heated section of the cutting line is subsequently cooled. A scanner motion produces the heat radiation spot so that edge portions of elevated radiation intensity coincide with a V- or U-shaped curve, which is open at the leading end of the heat radiation spot. The peak portion of the V- or U-shaped curve on the cutting line is at a temperature maximum that is under the melting point of the workpiece material. A controller of the scanning motion controls the scanner in circular cutting and freeform cutting so that a curved V- or U-shaped intensity distribution which fits the curved cutting path arises.

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Huenstetten, Germany

Georg Geissler