Siemens Aktiengesellschaft

Gigaset Communications Gmbh

Georg Busch

Volker Detering

Ludger Hinken

Ralf Lorenz

Ralf Hünting

Christoph Fels

Alois Lensing

The invention relates to a printed board which comprises an inlay and on whose one face electrical components are provided and on whose other face at least one single cooling element for cooling the components is mounted. A component to be cooled, the inlay and the cooling element are aligned with each other. The components are SMD components of, e.g., a high-power output stage circuit with heat emissions of up to 10 to 15 watt. In order to cool the structure, the heat produced in a heating zone between the pins of a component to be cooled is guided to the inlay which is dimensioned in such a manner that it extends farther than below the pins of the component to be cooled. In order to prevent short-circuits and allow power connections, an additional layer is arranged on the printed board above the inlay and simultaneously below the component to be cooled and comprises thermic provisions between a component to be cooled and the inlay for ensuring a good to excellent heat conduction from the heating zone of a component to be cooled to the inlay.

Printed board

A reproduction-receiver part is provided for use in a headset system, wherein parts are provided for wireless reception of audio signals from a mobile radio telephone network and a loudspeaker for acoustic reproduction of the signals.

Radio headset system

A printed circuit board for electrical devices having RF components, particularly for mobile radio telecommunication devices, wherein to increase the packing density of electronic circuits and conductor-track structures on such circuit board, a &ldquo;micro via&rdquo; coating is initially applied to one or both sides of a printed circuit board assembly. This &ldquo;micro via&rdquo; coating then has, in particular, RF circuits and RF conductor-track structures applied to at least part of its surface. Finally, the RF circuits and RF conductor-track structures are protected in relation to an RF ground coating of the printed circuit board assembly by barrier areas arranged in an assembly coating, situated directly below the &ldquo;micro via&rdquo; coating, of the printed circuit board assembly against interfering influences which impair the RF parameters, to be set in each case, of the RF circuits and RF conductor-track structures.

Printed circuit board for electrical devices having RF components, particularly for mobile radio telecommunication devices

Growing community of inventors

Ahaus, Germany

Georg Busch