Infineon Technologies Ag

Georg Borghoff

Alexander Hoehn

Andras Bertalan

Reinhold Bayerer

Thilo Stolze

Karsten Guth

Reinhold Spanke

Alexander Ciliox

Thomas Nuebel

Torsten Groening

Martin Woelz

A semiconductor module includes a base plate having an inner region adjacent an edge region, a substrate attached to the inner region of the base plate and a heat sink on which the base plate is mounted so that the base plate is interposed between the substrate and the heat sink and at least part of the inner region of the base plate contacts the heat sink. The module further includes a stress relief mechanism configured to permit the base plate to bend away from the heat sink in the edge region responsive to a thermal load so that at least part of the inner region of the base plate remains in contact with the heat sink.

Elastic mounting of power modules

A power semiconductor module includes a module housing and a circuit carrier having a dielectric insulation carrier and an upper metallization layer applied onto an upper side of the dielectric insulation carrier. A semiconductor component is arranged on the circuit carrier. The power semiconductor module also has an electrically conductive terminal block connected firmly and electrically conductively to the circuit carrier and/or to the semiconductor component. The terminal block has a screw thread that is accessible from an outer side of the module housing. A method for producing such a power semiconductor module is also provided.

Power semiconductor module and method for producing a power semiconductor module

A power semiconductor module is produced by: providing an electrically conductive terminal block having a screw thread, a connecting conductor having first and second sections, a module housing, a circuit carrier having a dielectric insulation carrier and an upper metallization layer on an upper side of the insulation carrier, and a semiconductor component; fitting the semiconductor component on the circuit carrier; producing a firm and electrically conductive connection between the terminal block and the connecting conductor at the first section; producing a material-fit and electrically conductive connection between the circuit carrier or the semiconductor component and the connecting conductor at the second section; and arranging the terminal block and the circuit carrier fitted with the semiconductor component on the module housing so the semiconductor component is arranged in the module housing and the screw thread is accessible from an outer side of the module housing.

Method for producing a power semiconductor module

An electrical connection module system includes a first connection plate with a first connection end and at least one first foot section, a first screw nut, and a dielectric holder. The dielectric holder has a first reception region for receiving the first screw nut. The first connection plate can, when the first screw nut is placed in the first reception region, be pushed onto the dielectric holder and be brought into a first target position such that the first screw nut is arranged between the dielectric holder and the first connection end and is held by the first connection end in the first reception region in such a way that the first screw nut cannot fall out.

Electrical connection module, semiconductor module and method for producing a semiconductor module

Power semiconductor module

A semiconductor module system includes a first semiconductor module and a second semiconductor module. The first semiconductor module has a first housing and a first base plate. The second semiconductor module has a second housing and a second base plate. The first base plate includes a first fitting segment fitted with a semiconductor component, and a first adjustment segment separated from the first fitting segment. The first adjustment segment also has a first adjustment device. The second base plate has a second adjustment device. The first semiconductor module and the second semiconductor module are configured to be positioned relative to one another using the first adjustment device and the second adjustment device so as to form at least one undercut connection. The first fitting segment and the first adjustment segment are connected to the first housing in a captive manner even when the undercut connection is not formed.

Power semiconductor module system with undercut connection

A power semiconductor module includes an electrically conductive connecting element, an accommodating region, and a clamping element which can be brought from a first position into a second position. If the clamping element is situated in the first position, a connecting region of a module-external connecting conductor can be inserted into the accommodating region and be clamped to the power semiconductor module with the formation of an electrically conductive connection between the connection region and the connecting element. For this purpose, the clamping element is brought from the first position into the second position.

Power semiconductor module and power semiconductor module system

A die fixing method is disclosed which includes providing a substrate having a metallized surface, forming a joining material on the metallized surface and placing a die alignment member with a plurality of openings on the substrate so that portions of the joining material are exposed through the openings. The method further includes placing a plurality of dies in the openings of the die alignment member with a bottom side of each die in contact with part of the joining material and attaching the plurality of dies to the metallized surface of the substrate at an elevated temperature and pressure, the die alignment member withstanding the elevated temperature and pressure. The die alignment member is removed from the substrate after the plurality of dies are attached to the metallized surface of the substrate.

Die fixing method and apparatus

A power semiconductor module includes a package having a first package portion and a second package portion. The side of the first package portion facing the second package portion has an anchoring element with a first recess. The second package portion includes a second recess with an indentation which receives the anchoring element. To produce a mechanically firm connection between the first package portion and the second package portion, a plug-in element is inserted in the first recess and the second recess. The plug-in element displaces the anchoring element transversely with respect to the plug-in direction, causing the anchoring element to engage the indentation so that a form-fit connection is produced between the first package portion and the second package portion. The plug-in element prevents the anchoring element from disengaging the indentation.

Power semiconductor module with interconnected package portions

A method for reducing variations in the bending of rolled metal base plates for semiconductor modules is disclosed. In this method, the base plates are rolled in their longitudinal direction in a specific manner.

Growing community of inventors

Warstein, Germany

Georg Borghoff