Ekra Automatisierungssysteme Gmbh

Ekra Eduard Kraft Gmbh

Georg Baier

Hartmut Drose

A device and a method for processing flat substrates, such as circuit boards or the like to be printed, is provided. The substrate can be fed resting on a transport device on two opposite side edge regions, can be first lifted from below for the purpose of processing through supports and pressed against corresponding hold-down pieces in the side edge regions, and can be clamped on the corresponding side edges of the substrate in this position, resting on the supports, between two clamping strips, whereupon the hold-down piece can be lowered to the side away from the substrate and the clamping strip and further below the region of the upper side of the substrate thus loaded, such that full-surface processing can take place.

Device and method for processing flat substrates such as for printing circuit boards or the like

A conveyor and fixing unit are provided for fitting in a printing machine, which can be used to apply solder paste to a substrate, for example, a printed circuit board, at predetermined points. The substrate may also be a ceramic object, a flexible tape, a wafer, or other body suitable for the material to be applied. The material may also be an adhesive, silicone or epoxy resin. In order to execute a printing process for the application of solder paste, the substrate to be printed is conveyed by the conveyor unit from a substrate stack to the printing machine, where the substrate is aligned relative to a mask there provided, and solder paste is then applied to the areas of the printed circuit board to be printed by means of a doctor blade.

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Munich, Georgia

Georg Baier