Samsung Electronics Co., Ltd.

Geon-Woo Park

You-Seung Jin

Se-Young Lee

Sang-Won Kim

Geum-Jong Bae

In-Wook Cho

Myung-Yoon Um

Jin-hee Kim

Byoung-jin Lee

Myoung-Kyu Seo

A semiconductor device can include a semiconductor chip, a protective layer pattern, an under bump metallurgy (UBM) layer, and conductive bumps. The semiconductor chip can include a pad and a guard ring. The protective layer pattern can be formed on the semiconductor chip to expose the pad and the guard ring. The UBM layer can be formed on the protective layer and can directly make contact with the pad and the guard ring. The conductive bumps can be formed on a portion of the UBM layer on the pad. Thus, the UBM layer and the guard ring can directly make contact with each other, so that a uniform current can be provided to the UBM layer on the pad regardless of a thick difference of different portions of the UBM layer.

Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package

Erasure methods for a nonvolatile memory cell that includes a gate electrode on a substrate, source and drain regions in the substrate at respective sides of the gate electrode, and a charge storage layer interposed between the gate electrode and the substrate. A nonzero first voltage is applied to the source region starting at a first time. While continuing to apply the first nonzero voltage to the source region, a second voltage having an opposite polarity to the first voltage is applied to the gate electrode starting at a second time later than the first time. The second voltage may increase in magnitude, e.g., stepwise, linearly and/or along a curve, after the second time.

Soft erasing methods for nonvolatile memory cells

Growing community of inventors

Suwon-si, South Korea

Geon-Woo Park