Asml Holding N.v.

Asml Netherlands B.v.

Geoffrey O'Connor

Raymond Wilhelmus Louis Lafarre

Matthew Lipson

Tammo Uitterdijk

Adrianus Hendrik Koevoets

Michael L Nelson

Robert D Harned

Michael Andrew Chieda

Timothy O'Neil

Jacobus Cornelis Gerardus Van Der Sanden

Jacobus Cornelius Gerardus Van Der Sanden

A lithographic apparatus includes a clamp () configured to receive an object (). The clamp defines at least one channel () configured to pass a fluid at a first fluid temperature. The lithographic apparatus also includes a chuck () coupled to the clamp. The chuck () defines at least one void () configured to thermally insulate the chuck from the clamp.

Chucks and clamps for holding objects of a lithographic apparatus and methods for controlling a temperature of an object held by a clamp of a lithographic apparatus

A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Bonding silicon silicon carbide to glass ceramics

Growing community of inventors

Easton, CT, United States of America

Geoffrey O'Connor