Dow Corning Corporation

Dow Corning Toray Company, Ltd.

Geoffrey Bruce Gardner

Brian Harkness

Randall Gene Schmidt

Gregory Scott Becker

Steven Swier

Masaaki Amako

Shin Yoshida

Yeong Joo Lee

Sina Maghsoodi

Satyendra Kumar Sarmah

Louise Ann Malenfant

Louise Malenfant

Satyendra Sarmah

An optical article includes a silicone-containing composition. The silicone composition includes a first region having a first refractive index and a second region having a second refractive index. The first refractive index is different than the second refractive index.

Gradient polymer structures and methods

A method for preparing sensing devices (biosensors) includes the steps of: (1) applying a photopatternable silicone composition to a surface in a sensing device to form a film, (2) photopatterning the film by a process comprising exposing the film to radiation through a photomask without the use of a photoresist to produce an exposed film; (3) removing regions of the non-exposed film with a developing solvent to form a patterned film, which forms a permselective layer or an analyte attenuation layer covering preselected areas of the sensing device.

Photopolymerizable silicone materials forming semipermeable membranes for sensor applications

A method for temporary wafer bonding employs an addition reaction curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a solvent. The film prepared by curing the composition is removable with an etching solution.

Temporary wafer bonding method for semiconductor processing

A method for reworking semiconductor materials includes: (i) applying a silicone composition to a surface of a substrate to form a film, (ii) exposing a portion of the film to radiation to produce a partially exposed film having non-exposed regions covering a portion of the surface and exposed regions covering the remainder of the surface; (iii) heating the partially exposed film for an amount of time such that the exposed regions are substantially insoluble in a developing solvent and the non-exposed regions are soluble in the developing solvent; (iv) removing the non-exposed regions of the heated film with the developing solvent to form a patterned film; (v) heating the patterned film for an amount of time sufficient to form a cured silicone layer; and (vi) removing all or a portion of the cured silicone layer by exposure to an anhydrous etching solution including an organic solvent and abase.

Method for forming and removing a patterned silicone film

A planar optical waveguide assembly prepared by a method comprising the steps of (i) applying a curable polymer composition to a surface of a substrate to form a polymer film; (ii) curing the polymer film to form a lower clad layer; (iii) applying a silicone composition to the lower clad layer to form a silicone film; (iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23&#xb0; C. for light having a wavelength of 589 nm; wherein the lower clad layer has a refractive index less than the refractive index of the silicone core.

Planar optical waveguide assembly

A method of preparing a planar optical waveguide assembly, comprising the steps of (i) applying a curable polymer composition to a surface of a substrate to form a polymer film; (ii) curing the polymer film to form a lower clad layer; (iii) applying a silicone composition to the lower clad layer to form a silicone film; (iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23&#xb0; C. for light having a wavelength of 589 nm; wherein the lower clad layer has a refractive index less than the refractive index of the silicone core. A planar optical waveguide assembly prepared according to the method of the invention.

Planar optical waveguide assembly and method of preparing same

A method of preparing a planar optical waveguide assembly, comprising the steps of: (i) applying a silicone composition to a surface of a substrate to form a silicone film; (ii) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (iii) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (iv) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23&#xb0; C. for light having a wavelength of 589 nm; wherein the substrate has a refractive index less than the refractive index of the silicone core. A planar optical waveguide assembly prepared according to the method of the invention.

A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.

Growing community of inventors

Midland, MI, United States of America

Geoffrey Bruce Gardner