Asml Holding N.v.

Asml Netherlands B.v.

Geoffrey Alan Schultz

Christopher Charles Ward

Laurentius Johannes Adrianus Van Bokhoven

Frank Johannes Jacobus Van Boxtel

Ruud Hendrikus Martinus Johannes Bloks

Hakki Ergün Cekli

Jean-Philippe Xavier Van Damme

Lowell Lane Baker

Daniel Nicholas Galburt

Johannes Onvlee

Herman Vogel

Daniel Nathan Burbank

Santiago E Delpuerto

Thomas Venturino

Güneş Nakíboglu

Güneş Nak{dot Over (i)}boglu

A patterning apparatus for a lithographic apparatus, the patterning apparatus including a patterning device support structure configured to support a patterning device having a planar surface; a patterning device conditioning system including a first gas outlet configured to provide a first gas flow over the planar surface in use and a second gas outlet configured to provide a second gas flow over the planar surface in use, wherein the first gas outlet and the second gas outlet are arranged at different distances perpendicular to the planar surface; and a control system configured to independently control a first momentum of gas exiting the first gas outlet and a second momentum of gas exiting the second gas outlet or to independently vary the first gas flow and/or the second gas flow over the planar surface of the patterning device.

Patterning device cooling apparatus

An apparatus, system, and method cool a patterning device by supplying a non-uniform gas flow. The apparatus and system include a gas supply structure that supplies a gas flow across the first surface of the patterning device. The gas supply structure includes a gas supply nozzle specially configured to create a non-uniform gas flow distribution. A greater volume or velocity of the gas flow is directed to desired portion of the patterning device.

Reticle cooling by non-uniform gas flow

In one embodiment of the present invention, there is provided a gas gauge for use in a vacuum environment having a measurement gas flow channel. The gas gauge may comprise a measurement nozzle in the measurement gas flow channel. The measurement nozzle may be configured to operate at a sonically choked flow condition of a volumetric flow being sourced from a gas supply coupled to the measurement gas flow channel. The gas gauge may further comprise a pressure sensor operatively coupled to the measurement gas flow channel downstream from the sonically choked flow condition of the volumetric flow to measure a differential pressure of the volumetric flow for providing an indication of a gap between a distal end of the measurement nozzle and a target surface proximal thereto.

Gas gauge compatible with vacuum environments

A gas gauge () is provided for use in a vacuum environment having a measurement gas flow channel (). The gas gauge comprises a measurement nozzle () in the measurement gas flow channel (). The measurement nozzle () is configured to operate at a sonically choked flow condition of a volumetric flow being sourced from a gas supply () coupled to the measurement gas flow channel (). The gas gauge () further comprises a pressure sensor () operatively coupled to the measurement gas flow channel () downstream from the sonically choked flow condition of the volumetric flow to measure a differential pressure of the volumetric flow for providing an indication of a gap () between a distal end of the measurement nozzle () and a target surface () proximal thereto.

Growing community of inventors

Shelton, CT, United States of America

Geoffrey Alan Schultz