Permelec Electrode Ltd.

Other

Institute of National Colleges of Technology, Japan

Genzo Yamane

Yoshinori Nishiki

Yasuo Nakajima

Masaharu Uno

Tsuneto Furuta

Kazuhiro Hirao

Kunio Nishimura

Katsumi Hamaguchi

Noriyuki Kitaori

Kenichi Ueno

Kota Sekido

Hozumi Tanaka

Akira Katsumoto

The present invention provides: a membrane-electrode assembly having a first electrode having a shape of a rod-form or a cylindrical-form, a strip-form diaphragm covering the periphery of the first electrode, and a second electrode disposed on a surface of the strip-form diaphragm; an electrolytic unit containing the membrane-electrode assembly; an electrolytic water ejecting apparatus containing the electrolytic unit; and a method of sterilization using the membrane-electrode assembly.

Membrane-electrode assembly, electrolytic unit using the same, electrolytic water ejecting apparatus, and method of sterilization

An electrolytic cell and process for the simultaneous production of hydrogen peroxide and hypochlorous ion. The electrolytic cell has an anode chamber housing an insoluble anode capable of oxidizing halide ion, a cathode chamber housing a gas diffusion cathode capable of oxidizing an oxygen-containing gas to produce hydrogen peroxide, a membrane separating the anode and cathode chambers, and means for supplying water containing halide ion to the anode chamber and an oxygen-containing gas and an electrolyte to the cathode chamber, whereby hypohalide and hydrogen peroxide are produced in the anode chamber and the cathode chamber, respectively. Also disclosed is a process for treating water using the electrolytic cell.

Electrolytic cell and process for the production of hydrogen peroxide solution and hypochlorous acid

A method of copper-plating a material whereby electrolysis is performed using an electrolytic plating cell including a diaphragm which separates an anode chamber having therein an insoluble metal electrode as an anode from a cathode chamber having therein the material to be plated as a cathode, and further using an electrolyte solution containing copper ions and an additive, wherein the electrolyte is fed to the cathode chamber in a manner such that the copper ion concentration in the electrolyte within the cathode chamber is kept constant and electrolyte is further fed to the anode chamber at a rate of from about 0.2 to 11 ml/KAh.

Method of copper plating

Growing community of inventors

Fujisawa, Japan

Genzo Yamane