Seagate Technology Incorporated

Gennady G Gauzner

Nobuo Kurataka

Kim Yang Lee

David S Kuo

Koichi R Wago

Michael R Feldbaum

Neil Deeman

Li-Ping Wang

Justin Jia-Jen Hwu

Zhaoning Yu

Yautzong Hsu

Christopher Formato

HongYing Wang

Sang-Min Park

ShuaiGang Xiao

Hong Ying Wang

David Shiao-Min Kuo

Dieter Klaus Weller

William J O'Hollaren

A pattern imprint template incudes a patterned recesses and a layer formed over the patterned recesses. The pattern recesses form a pattern in a resist when brought in contact with a substrate with a resist thereon. The layer formed over the patterned recesses has a first surface energy. The first surface energy is lower in comparison to a second surface energy of the substrate with the resist thereon. The lower first surface energy in comparison to the second surface energy of the substrate avoids trapping gas in the resist by pushing gas toward the imprint template for venting through the patterned recesses.

Method of surface tension control to reduce trapped gas bubbles

A method is disclosed that includes forming at least one substrate alignment mark and at least one lithography alignment mark in a substrate; forming a seed layer on the substrate; and forming a guide pattern and at least one guide pattern alignment mark in the seed layer, where the at least one guide pattern alignment mark is formed over the at least one substrate alignment mark. The method further includes determining an alignment error of the at least one guide pattern alignment mark relative to the at least one substrate alignment mark; and patterning features on at least one region of the substrate, where the features are positioned on the substrate based on the at least one lithography alignment mark and the alignment error.

Bit patterned media template including alignment mark and method of using same

The embodiments disclose a method of fabricating a stack, including replacing a metal layer of a stack imprint structure with an oxide layer, patterning the oxide layer stack using chemical etch processes to transfer the pattern image and cleaning etch residue from the stack imprint structure to substantially prevent contamination of the metal layers.

Method of patterning a stack

Provided herein in an apparatus, including a substrate; a functional layer, wherein the functional layer has a composition characteristic of a workpiece of an analytical apparatus; and pre-determined features configured to calibrate the analytical apparatus. Also provided herein is an apparatus, including a functional layer overlying a substrate; and pre-determined features for calibration of an analytical apparatus configured to measure the surface of a workpiece, wherein the functional layer has a composition similar to the workpiece. Also provided herein is a method, including providing a lithographic calibration standard having a functional layer to an analytical apparatus, wherein the functional layer has a composition characteristic of a workpiece of the analytical apparatus; providing calibration standard specifications to a computer interfaced with the analytical apparatus; and calibrating the analytical apparatus in accordance with calibration standard readings and the calibration standard specifications.

Calibration standard with pre-determined features

Provided herein is an apparatus, including a substrate; an etch stop layer overlying the substrate, wherein the etch stop layer is substantially resistant to etching conditions; and a patterned layer overlying the etch stop layer, wherein the patterned layer is substantially labile to the etching conditions, and wherein the patterned layer comprises a number of features including substantially consistent feature profiles among regions of high feature density and regions of low feature density.

Apparatuses and methods utilizing etch stop layers

The embodiments disclose a method of surface tension control to reduce trapped gas bubbles in an imprint including modifying chemistry aspects of interfacial surfaces of an imprint template and a substrate to modify surface tensions, differentiating the interfacial surface tensions to control interfacial flow rates of a pre-cured liquid resist and controlling pre-cured liquid resist interfacial flow rates to reduce trapping gas and prevent trapped gas bubble defects in cured imprinted resist.

Provided herein are methods for depositing a spin-on-glass composition over an imprinted resist; curing the spin-on-glass composition to form a cured spin-on-glass composition; and forming a patterned mask by etching the cured spin-on-glass composition, the resist, and an underlying mask composition, wherein the patterned mask comprises features of the cured spin-on-glass composition atop the mask composition, and wherein curing the spin-on-glass composition is configured to prevent shifting or toppling of the spin-on glass composition from atop the mask composition while forming the patterned mask.

Patterned mask using cured spin-on-glass composition

The embodiments disclose a method of stack patterning, including loading a stack into a stationary stack stage, rotating one or more ion beam grid assemblies substantially concentrically aligned with the stationary stack stage to etch the stack and controlling the operation of the one or more ion beam grid assemblies to achieve substantial axial uniformity of the etched stack.

Method of stack patterning using a ion etching

The embodiments disclose a method of creating two-sided template from a single recorded master, including fabricating a first template using a single recorded master, wherein the first template has a changed duty cycle and an unchanged servo arc orientation, creating a replicate of the first template, wherein the replicate has a mirrored servo arc orientation and a changed duty cycle and fabricating a second template using the replicate to produce a predetermined mirrored servo arc orientation and a predetermined duty cycle for imprinting on a second side of a patterned stack.

Method of creating two-sided template from a single recorded master

Processes include aligning a disc with a template at a location so that the pattern from the template is transferred to the disc in a relative orientation. The relative orientation provides that when the disc with the transferred pattern is finally assembled into a hard disc drive, an inner diameter of the spindle hole of the disc may be abutted against an outer diameter of the disc drive spindle, and the data-containing patterns on the discs will be aligned concentrically with a center of the disc drive spindle. While the data-containing patterns are aligned concentrically with the disc drive spindle, the substrate itself is allowed to be non-concentric. Still other aspects include a disc having eccentric formations including PIM and one or more of bit patterns and servo information formed on a disc surface, the eccentricity of the formations is determined based on an expected difference between the radius of the spindle hole of the disc and the radius of the spindle on which the disc will be placed during assembly, with the PIM used to determine the angular alignment of the disc with the spindle.

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Livermore, CA, United States of America

Gennady G Gauzner