Hon Hai Precision Industry Co., Ltd.

Foxconn Interconnect Technology Limited

Fuding Precision Components (shenzhen) Co., Ltd.

Genn-Sheng Lee

Ming-Lun Szu

Yao-Chi Huang

Fang-Jwu Liao

Hsiu-Yuan Hsu

Jwomin Wang

Hao-Yun Ma

Robert G McHugh

Shuo-Hsiu Hsu

Shih-Wei Hsiao

Jia-Hau Liu

David Gregory Howell

Chi-Nan Liao

Paul Chen

Wei-Chih Lin

Chao-Chung Cheng

Chih-Chung Hsieh

Masao Ohkita

Sen-Jong Chen

Cheng-Kai Huang

Yi-Feng Lo

Li-Chen Chen

Mao-Chun Weng

Wen-Yi Rai

Yen-Hsu Ko

Wayne Chou

A interconnection system includes a panel side kit and a wall-mount kit coupled with each other and secured together via magnetic forces. The wall-mount kit includes a printed circuit board enclosed within a bracket and defining a center region for power transmission and a pair of side regions for high speed transmission. In the side regions, on the coupling side a plurality of wireless transmission units are located while on the back side a plurality of ROSA OE modules are provided to transfer the optical signal from optical fibers to the electronic signal for wireless transmission wherein the optical fibers are linked to a control box via a plurality of TOSA EO modules. The panel side kit includes wireless receiving units that interact with the wireless transmission units, and a plurality of connectors with the body of the display.

Interconnection system with hybrid transmission

An microfluidic device includes a substrate () having a wandering groove () formed on a first surface () thereof; a shielding member () abutting on the first surface and covering the groove to form a flow channel () to deliver blood; an inlet () at one end of the flow channel for introducing the blood into the flow channel; and an outlet () at another end of the flow channel for discharging the blood. The flow channel () has a detecting region () for the blood passing through separately, the detecting region includes an entry () for a single cell entering into at a time and an exit () for a single cell exiting out at a time. A pair of electrodes () are disposed between the entry () and the exit () to detect the cells () of the blood.

Microfluidic device for detecting cells of blood

A lens-integrated optical waveguide includes an optical conduit, a lens, and a non-wetting coating underlying the lens. A method for making an lens-integrated optical waveguide includes: forming an optical conduit having an end defining a planar end surface through which lights are transmitted out and received in; injecting a curable glue into a mold to form a pool of curable glues, the mold including a cavity having a concave shape to define a lens outer face; dipping the planar end of the optical conduit into the pool of curable glues; and curing the pool of curable glues onto the planar end surface of the optical conduit.

Lens-integrated optical waveguide and method of making the same

A power interconnection system is provided including a printed circuit board (), a voltage regulator package (), and an electrical connection socket () adapted for receiving a chip package () therein. The electrical socket and the voltage regulator package are mounted and electrically coupled to opposite surfaces of the printed circuit board. Thus, the voltage regulator package and the chip package are held in a substantially opposed relationship relative to the printed circuit board after the chip package is mounted onto the socket. Therefore, with such configuration, a lower impedance connection is achieved between the chip package and the voltage regulator package in comparison with the conventional configuration.

Interconnection system between CPU and voltage regulator

According to one embodiment of the present invention, an electrical connector () includes an insulative housing () defining a number of passages () and a number of conductive terminals () seated in corresponding passages, respectively. The conductive terminal includes a base section (), a bent section () projecting angularly from the base section and having a planar section () parallel with the base section, a spring arm () sticking upwardly and obliquely out of the passage, and a soldering pad () to be mounted on a circuit substrate ().

Electrical connector

A land grid array socket () comprises an insulative housing () having a plurality of passageways () extending throughout a top surface () and an opposite bottom surface () and a plurality of electrical terminals () received in corresponding passageways, respectively. Each terminal including a base portion () in the passageway and a first spring arm () extending out of the top surface of the housing and adapted to be electrically connected with a first electronic component () and a second spring arm () extending out of the bottom surface of the housing and adapted to be electrically connected with a second electronic component (). Wherein the first and the second spring arms each has a resisting portion (), the resisting portions resist the base portion when the spring arms are pressed by the first and the second electronic components so as to form a shorter electrical circuit path between the electronic components.

Land grid array socket having improved terminals

A land grid array socket is provided which includes an insulative housing () having a plurality of passageways () each accommodating an electrical terminal () therein. Contacting ends () of the terminal in a same row of the passageways all extend along a predetermined lateral direction, and because of bend of a bending portion () in the terminal, the contacting end of the terminal in one passageway does not overlap with another terminal in an adjacent passageway along a vertical direction so as to avoid short circuit risk therebetween.

Land grid array socket having terminals with spring arms

Electrical contact

A socket connector for carrying an integrated circuit package includes an insulative housing, a stiffener surrounding the housing, a load plate pivotably assembled with one end of the stiffener and a load lever pivotably attached to the other end of the stiffener. The load plate defines a pair of pressing portions. Each of the pressing portions defines a wider part and a narrower part. During the rotation process of the load plate, the wider part firstly presses a pressing point of the IC package. A critical point, on which the wider part firstly presses, is ascertained that a distance from the critical point to a center of the IC package is approximately 5/24 of the entire length along the same direction. The pressing point is within a range from the critical point to the center of the IC package.

Socket connector for carrying integrated circuit package

An electrical connector includes a base ('), a metal clip () pivotably engaged on the base, and a lever () for fastening the clip onto the base. A floor (&#x2032;) is defined in a middle of the base. A rectangular raised support area (&#x2032;) is provided around a periphery of the floor. The support area defines four inner side walls (&#x2032;). The side walls and the floor cooperatively define a substantially rectangular cavity (&#x2032;) therebetween. One of the side walls defines a pair of protrusions (&#x2032;) protruding towards the cavity, wherein the two protrusions are coplanar with each other. The other side walls define a protrusion thereof respectively. Therefore, a first benchmark is obtained by a line joining the pair of protrusions on the side wall, and a second benchmark is determined by a line passing the protrusion on the adjacent and perpendicular side wall, perpendicular to the first benchmark.

Electrical connector with accurate measuring benchmarks

A socket connector ( ) for electrically connecting an IC package and a PCB includes a base ( ), a cover ( ) slidably mounted on the base, an actuator mechanism ( ) sandwiched between the cover and the base, and a plurality of terminals received in the base. The cover has a side wall ( ) forming an engaging member ( ) thereon. The actuator mechanism includes an actuating lever ( ) having mating means ( ) protruding toward the side wall of the cover. The mating means mates with the engaging member to prevent the actuating lever from springing back from position. Thus the IC package is securely mounted on the connector. Additionally, the actuating lever is spaced from the side wall of the cover, thereby allowing convenient operation of the actuating lever.

Socket connector with resiliently engaged actuator mechanism

A contact for being received in an electrical socket which interconnects an integrated circuit (IC) package with a printed circuit board (PCB), comprises a contact portion for electrically connecting with a pin of the IC package, a locating portion for interferentially engaging with insulative housing of the electrical socket, and a tail portion having a plurality of clip arms. When a solder block is inserted into the tail portion, the clip arms can deflect to secure the solder block in a predetermined position in the tail portion.

Electrical contact for retaining solder preform

An electrical socket for electrically connecting with a pin of a IC package. A contact secured in the socket comprises first and second claw portions formed on opposite ends thereof and two spring arms between the first and second claw portions for being engaged with the IC package pin. The first and second claw portions have two claw feet, respectively. The four claw feet define a clip section in which a solder ball can be received and kept in a predetermined plane when the solder ball is pressed towards the contact. The claw feet can grip the solder ball firmly to avoid the falling of the solder ball during assembling and soldering procedure.

Ball grid array connector having improved contact configuration

An electrical connector for electrically connecting pins of an external electrical device with a printed circuit board comprises an insulative housing, a plurality of contact-receiving passages defined in the insulative housing, and a plurality of contacts secured in corresponding contact-receiving passages. The insulative housing has stopping blocks which are positioned beside the contact-receiving passages for blocking the pins of the external electrical device.

Electrical connector having improved housing structure

A method for forming fine pitch contacts ( ) used in a ZIF socket comprises the following steps: stamping a contact strip ( ) to form a plurality of contacts each comprising a first portion, a retaining portion ( ) and a second portion being coplanar with each other, the first portion comprising a pair of arcuate arms ( ) defining a circular receiving space ( ) therebetween and a pair of parallel contacting fingers ( ) defining engaging space ( ) therebetween; bending the first portion to form a contacting portion ( ) perpendicular to the retaining portion and the second portion; bending the second portion to form a soldering portion ( ) perpendicular to the retaining portion and parallel to the contacting portion.

Growing community of inventors

Tu-Chen, Taiwan

Genn-Sheng Lee